Thermal Profiling Guide Task Group
First Meeting October 14, 2013
(IPC J-STD-7530)
Participants:
Ray Prasad, Ray Prasad Consultancy Group (Chairman)
David Hwang, Space Exploration Technologies, Ca
Carrie Hofmann, Daktronics
Robert Dervaes, FCT Assembly, Co
Dudi Amir, Interl,
Jose Servin, Continental, Mexico
Alejandro Cruz, Jabil, Mexico
Constantino Gonzales, ACME,
Gaston Hidalgo, Samsung, Tx
Rick Iodice, Raytheon, Ma
Ursula Marquez de Tino, Plexus, IL
Greg Wade, Indium, NY
Dan Eifert, Lockheed Martin, Fl
Robert Rowland, Axiom, Or
Paul Austen, ECD
Meeting Notes:
This is the first meeting to review this document
Need to expand on how to profile BGA
Want to have a practical document
Document only has few paragraphs in thermal profiling
Missing definitions
What the document should include?
- Definition
- Profile
- Ramp
- Soak
- Peak
- Melting point
- TAL
- True TAL
- Delta T
- Superheat
- Pasty range
- Cool down
- Preheat
- What profiles should it cover?
- Wave
- Adhesive cure profile
- SelectivePallet Soldering
- Selective (Point to Point) Rob Rowland, Chris Smith, Fred Beltran
- Reflow
- Class 1 convection
- Class 2 IR/Convection
- Class 3 IR,
- VPS
- Special Applications
- Laser
- Inductive Soldering
- Hot Bar
- Hot Belt
- Reflow profile for rework
- Profile Development and Guidelines
- Loaded Board versus Bare Board
- Thermocouple selection ( length, gauge, welded, insulation)
- Location of thermocouples
- Attachment of thermocouplesPaul Austen
- Alternatives to thermocouples
- Paste in hole (intrusive)
- Calibration
- Thermocouples
- Ovens
- Profilers
- Profiling Process Control
- Machine profiler
- Aluminum plate as a machine profiler
- Profiling Process Guideline
- Four stages of reflow profiler
- Flux/Paste consideration
- Cleanliness Eric Camden
- Alloys
- SnPb
- Lead Free
- Low Temp
- High Temp
- Profiling of temperatures for sensitive components, electrolytic aluminum, LEDs, (J-std-075)
- Environment (nitrogen, humidity, temp, altitude)
- High Thermal Mass Assembly – Chris Smith
- Reflow Profile Considerations
- Temperature variation across the board on large or small components
- Temperature sensitive components
- Component warpage
- Board warpage
- Laminate material
- Profile to Defect Relationship (similar to appendix A IPC 7095-C)Les Bogert, Jose Servin
- Void reduction
- Head on pillow
- Bridging
- Solder Balls
- Cold Solder
- Blow Holes Pin Holes
- Solder Beading
- Grainy Solder
- Opens Joint
- Tombstone
- Solder Wicking
- Skewing
- Non-Wetting
- De-Wetting
- Hot Slumping
- Component Crack
- Solder Joint Crack
- Pop Corn Delamination
- Thermal mass of components
- Copper distribution on PCB
Who the target audience is? Process engineer, advanced technicians.
Plan
Outline needs to be defined by end of the year 2013
Sections owners to be assigned by end of January 2014
Next meeting: in Portland in February 2014 (date to TBD)
Working meeting: APEX March 2014