Minutes from April 7th UK Pixel Module phone meeting
Present
Jo and Ray : Manchester
Richard, Andy and Aaron : Glasgow
John : STFC RAL
A: Update on the 4 chip module mask (electrical and mechanical) - Gian
Gian was not present to up date us.
Richard will call Gian to follow this up.
B: Update on VTT flip chip bonding - Richard
Richard gave an update on the progress with VTT.
The project will use 5 singles from an existing Micron wafer and then 5 quads and 15 singles from the new Micron sensor wafer to be designed (see above).
Mechanicals will also be assembled with the bad FE-I4s and a mechanical sensor version of the new Micron wafer.
We also discussed a thin sensor/ASIC project. Similar work being undertaken at VTT for ALICE.
Quote to arrive soon with a time scale of August for assemblies.
Richard to chase Maurice on FE-I4 mask design.
Update on bump bonding at STFC/RAL – John
Success using Semefab daisy chains was reported.
40 chains per chip 3000 bumps per structure.
Yield not yet perfect, about 1-2 chains failing, probably just one bump per chain.
Medipix daisy chains to be used next.
C: Update on 4 chip hybrid and module assembly - Jo/Ray
Hybrid from Bonn at Manchester now
Ray has spent some time working out the first sketch of what the assembly procedure might be.
Still a bit off having any drawings or documents. Expect to be ready to make dummies for August.
Request made for simple dummies to allow them to play. Richard will follow up CNM daisy chains to see what bond pads they have, plus could make something simple in Glasgow.
Jo will add a link on the Twiki to a document that details bond pads and alignment marks.
Richard will include in an e-mail to Maurice a question if the IBL module working group is the best place to discuss beyond IBL pixel module issues.
D: Any feedback from the AUW that is relevant – All
R/O of 4 chip module was mentioned. Talk about full HSIO system at Tuesdays AUW Pixel session was raised.
We should start to make a plan to readout the quad.
Serial powering talk at AUW discussed.
Pixel system for 2017 (NewPix) appear to believe that they will use serial powering.
John said that he would follow this up and report back on how he/we could be useful to this part of the project.
Welding of pipes near ASICs.
Heinz has been in contact with John regarding this. He is interested for the IBL.
They will provide some mounted ASICs and John will perform welding tests.
Andy (Glasgow) has offered to help with testing.
Expect that USBPix systems will be delivered in time for these tests. Richard has asked Edinburgh for a load on their system if there is a delay in the new USBPix systems.
E: FE-I4 and testing plans and experience - All
Glasgow, Manchester and RAL all expressed interest in testing assemblies for the IBL.
Manchester has a system with a scintillator running with FE-I3 adapter card. Waiting on FE-I4 card.
Glasgow and RAL need to set up a system.
Feeling that a more co-ordinated UK effort/response required here. Richard to follow this up (need to include Liverpool and Edinburgh and find out contact in IBL for assembly distribution and site qualification)
F: FE-I4 and testing plans and experience - All
Glasgow (Andy and Aaron) and a Manchester student (sorry forgotten his name) had attended the FE-I4/USBPix tutorial in DESY this week.
The TimePix telescope will probably be able to accept FE-I4 assemblies this summer and will run for most of the summer at H8 (mostly parasitic).
Heinz is helping with the organisation of integrating FE-I4 into the telescope.
This is an excellent opportunity to test assemblies beyond IBL fluences.
Richard to muster interest from UK sensor groups.
G: AOB
MCM_D Aaron will chase Lars regarding organising a phone meeting with Acreo. The pertinent question is if the problems with the shorts in the last prototype can be solved.
--
I think that the agenda could go something like this:
Update on the 4 chip module mask (electrical and mechanical) - Gian
Update on VTT flip chip bonding - Richard
Update on 4 chip hybrid - Jo/Ray
Any feedback from the AUW that is relevant - All
(I would like to bring up serial powering and if this is an area where we should get involved.
See
https://indico.cern.ch/contributionDisplay.py?sessionId=14&contribId=37&confId=116547
which is a talk from Laura Gonella of Bonn.
)
FE-I4 and testing plans and experience - All
Testbeam plans for the summer - Richard et al.
AOB