Thermal Profiling Guide Task Group

First Meeting October 14, 2013

(IPC J-STD-7530)

Participants:

Ray Prasad, Ray Prasad Consultancy Group (Chairman)

David Hwang, Space Exploration Technologies, Ca

Carrie Hofmann, Daktronics

Robert Dervaes, FCT Assembly, Co

Dudi Amir, Interl,

Jose Servin, Continental, Mexico

Alejandro Cruz, Jabil, Mexico

Constantino Gonzales, ACME,

Gaston Hidalgo, Samsung, Tx

Rick Iodice, Raytheon, Ma

Ursula Marquez de Tino, Plexus, IL

Greg Wade, Indium, NY

Dan Eifert, Lockheed Martin, Fl

Robert Rowland, Axiom, Or

Paul Austen, ECD

Meeting Notes:

This is the first meeting to review this document

Need to expand on how to profile BGA

Want to have a practical document

Document only has few paragraphs in thermal profiling

Missing definitions

What the document should include?

  1. Definition
  2. Profile
  3. Ramp
  4. Soak
  5. Peak
  6. Melting point
  7. TAL
  8. True TAL
  9. Delta T
  10. Superheat
  11. Pasty range
  12. Cool down
  13. Preheat
  1. What profiles should it cover?
  2. Wave
  3. Adhesive cure profile
  4. SelectivePallet Soldering
  5. Selective (Point to Point) Rob Rowland, Chris Smith, Fred Beltran
  6. Reflow
  7. Class 1 convection
  8. Class 2 IR/Convection
  9. Class 3 IR,
  10. VPS
  11. Special Applications
  12. Laser
  13. Inductive Soldering
  14. Hot Bar
  15. Hot Belt
  16. Reflow profile for rework
  17. Profile Development and Guidelines
  18. Loaded Board versus Bare Board
  19. Thermocouple selection ( length, gauge, welded, insulation)
  20. Location of thermocouples
  21. Attachment of thermocouplesPaul Austen
  22. Alternatives to thermocouples
  23. Paste in hole (intrusive)
  24. Calibration
  25. Thermocouples
  26. Ovens
  27. Profilers
  28. Profiling Process Control
  29. Machine profiler
  30. Aluminum plate as a machine profiler
  31. Profiling Process Guideline
  32. Four stages of reflow profiler
  33. Flux/Paste consideration
  34. Cleanliness Eric Camden
  35. Alloys
  36. SnPb
  37. Lead Free
  38. Low Temp
  39. High Temp
  40. Profiling of temperatures for sensitive components, electrolytic aluminum, LEDs, (J-std-075)
  41. Environment (nitrogen, humidity, temp, altitude)
  42. High Thermal Mass Assembly – Chris Smith
  43. Reflow Profile Considerations
  44. Temperature variation across the board on large or small components
  45. Temperature sensitive components
  46. Component warpage
  47. Board warpage
  48. Laminate material
  49. Profile to Defect Relationship (similar to appendix A IPC 7095-C)Les Bogert, Jose Servin
  50. Void reduction
  51. Head on pillow
  52. Bridging
  53. Solder Balls
  54. Cold Solder
  55. Blow Holes Pin Holes
  56. Solder Beading
  57. Grainy Solder
  58. Opens Joint
  59. Tombstone
  60. Solder Wicking
  61. Skewing
  62. Non-Wetting
  63. De-Wetting
  64. Hot Slumping
  65. Component Crack
  66. Solder Joint Crack
  67. Pop Corn Delamination
  • Thermal mass of components
  • Copper distribution on PCB

Who the target audience is? Process engineer, advanced technicians.

Plan

Outline needs to be defined by end of the year 2013

Sections owners to be assigned by end of January 2014

Next meeting: in Portland in February 2014 (date to TBD)

Working meeting: APEX March 2014