Notes from WP1 Weekly Meeting 30Th/5

Notes from WP1 weekly meeting 30th/5

Notes by CB

Attending: Craig Buttar (CB), Richard Bates (RB), Tom Mcmullen (TM), Jo Pater (JP), Simon Brown (SBr), Dean Forshaw (DF), Sergey Burdin (SBu),Andreas Korn (AK), John Lipp (JL), Gian Luigi Casse (GC)

Apologies: John Matheson, YiorgiosSidiropoulos

Standing Agenda:

• Planar sensors
• 3D sensors/modules
• Planar modules
• FE-I4 testing

Actions from this meeting and pending actions

Date / What / Who / When
23/5 / Setup access for sharepoint / CB / Pending:
By next meeting
23/5 / Yiorgios to detail designs and calculations for “bandwidth tape”; / YS / Next meeting
30/5 / Check change in I-V with and without chip on and configured / TM / By next meeting
30/5 / Check if CiS, Hamamatsu, Medipix sensors have dicing streets / RB / By next meeting
30/5 / Discuss dicing streets with Micron / GC / By next meeting
30/5 / Discuss design of mask for dicing streets / GC/IS / By next meeting
30/5 / Check SSC cards from YS and submit for production / RB / By next meeting
30/5 / Report on pull-tests of over-etched FE-I4 Al pads from LETI / TM / Next meeting
30/5 / Update on SMC bow measuring tool / TM / Standing item
30/5 / Update on quad rigid board order / DF / Next meeting
30/5 / Add 2 FE-I4 wafers for RAL BB in August and additional wafer for Advacam BB to the Grand Plan. / RB / By next meeting
23/5 / Update on irradiated sensor I-Vs / DF/Paul Dervan / Pending:
Report 13/6
23/5 / Update on CERN Pixel V production at Micron / DF / Standing action
23/5 / Report on TB preparations from TB meeting / DF / Standing action
23/5 / Find out about number of chips that can be readout by GEN-1 system; find out about when GEN-3 systems will be available / AK / Report at 13/6 meeting
23/5 / Update on flex design / IlyaTsurin / Report at 13/6 meeting
23/5 / Update on LETI processing / TM / Postponed
to 13/6 meeting

N.B. Please circulate slides for meeting on Wednesday evening

Competed actions from last meeting

Date / What / Who / Status
23/5 / Setup sharepoint site for WP1 information
(does not replace Twiki) / CB / Done
23/5 / Upload sensor/module spreadsheetsharepoint and ensure everyone has access / CB / Pending:
By next meeting
23/5 / Send ~2-4? FE chips returned from VTT to Liverpool for board testing
Chips do not need to be green as long as they return a good digital scan / RB / Done
23/5 / Simon and Yiorgios to detail designs and calculations for “bandwidth tape”;
Simon to contact Yiorgios
Present update at next meeting / SBr,YS / Apologies from YS
Report at next meeting
23/5 / Dean to send sensors to Advacam / DF / Done
23/5 / Send sensor I-Vs for recently delivered modules to KD&TM / DF / Done
23/5 / Measure module I-Vs; present results at next meeting / KD/TM / See slides presented at this meeting
23/5 / Present I-Vs on paralyene coated / TM / See slides presented at this meeting
23/5 / Update on irradiated sensor I-Vs / DF/Paul Dervan / Pending:
Next meeting
23/5 / Update on SMC bow measuring tool / TM / Standing item
23/5 / YS to send SCC files to RB for checking and ordering / YS / Status unknown
23/5 / YS to resolve remaining issues on FE-I4B pcb with Fabian and report at next meeting / YS / Pending;
Next meeting
23/5 / TM requires CERN Pixel-V gds files. DF will send them to TM / DF / Done
23/5 / Update on CERN Pixel V production at Micron / DF / Done; see notes
23/5 / Report on TB preparations from TB meeting / DF / Done; see notes
23/5 / JL to present schedule and breakpoints for BB development / JL / Done; see slides
23/5 / Update on BB discussions between JL & TM / JL/TM / Done; see notes
23/5 / Report on ideas for pixel DAQ work / AK / See slides
23/5 / Update on LETI processing / TM / Postponed;
Next meeting

Discussion on bandwidth tape

Yiorgios and Simon have had a discussion regarding the bandwidth tape design.

They have understanding about what data rates are possible with standard thickness and width.

They are developing a test tape with ~10 options on it. This will vary parameters such as layout of ground plane and insulation thickness.

SB noted that a high data-rate tape is also being developed for LHCb, SB distributed slides.

There was a discussion of what data rate to target. It was decided that targeting 5 hexes was reasonable, which is ~5Gb/s.

YS will design the tapes using Altrium software and their characteristics will be simulated (egimpedence).

YS to report at the next meeting.

Module I-Vs (slides)

TM reported on I-Vsthat had been made on the probe station on recently delivered modules.

Quad 2 appears to have been damaged and no I-V can be made.

Quad 5 has a reasonable I-V but has a large leakage current.

Quad7 has a good I-V with increased breakdown voltage and reduced leakage current compared to pre-assembly.

See table in slides for details.

DF raised a comment that the chips should be on and configured when making I-Vs as the this affects the leakage current in each pixel. TM will check this on a single chip card.

TM showed photographs for the back of quad 2, which has been damaged. There are scratches across the sensors, and the corners appear to be particularly bad.

This will be discussed with Sami at Advacam. TM will also take photos of the working quads for comparison.

RB reported that Advacam was worried that there were no dicing streets on the back of the sensor wafers. This gums up their saw and may also lead to rough edges or chips that may degrade the I-V characteristics.

A discussion on whether to have dicing streets on the micron sensors was inconclusive. On the surface this seems like a reasonable idea but some of the implications of the processing are not clear eg it may result in exposed Si and/or we may not be able to make bias contact on the probe station.

The approach of CiS, Hamamatsu and Medipix sensors will be investigated. GC will seek the view of Micron.

Advacam can post process dicing streets on the sensors. GC will discuss with Ilyaabut producing a mask.

TM also reported on the I-Vs of paralene coated modules. The I-Vs indicate that there is no change in the I-V.

CERN Pixel-V status

DF reported that Micron were still aiming for end of June for delivery of CERN Pixel-V wafers.

These will be flipped at Advacam from 3rd week in July.

Need SSC cards soon, by end of June.

We have 2 Bonn SSC cards in hand.

RB reported that LETI had over-etched the Al bond pads of the first batches of FE-I4 wafers. Chips are being sent back from Advacam for bonding and pull-testing.

An order for flipping two quads at Advacam has been placed as a backup for the LETI wafers. This is subject to getting FE-I4 wafers.

The quad rigid board design is being finalised by Ilya. An order will be submitted next week and boards and the delivery time is expected to be 2 weeks. 20 quads will be ordered for the UK.

Testbeam

DF will confirm if Jens will provide an RCE system. Glasgow system will be prepared as a backup. CB will check status of adapter card with Andrew Stewart.

DF noted that analysis should be made with TBMon 1.1 as this includes time-dependent X, Y, Z corrections for different runs. This arises from thermal effects where the geometry can change as the system warms up. Apparently this makes a big difference.

Bump-bonding

JL presented his schedule.

This will require FE-I4 wafers by the end of August (RB will include this in the Grand Plan).

JL reported he was not investigating Cr UBM following what had been done at Selex.

JL also reported that the maximum temperature on a wafer is 40oC. Studies of the etch rate of Ar plasma is being investigated.

DAQ (slides)

AK presented an overview of the pixel DAQ systems, looking at current, near-term and future systems.

The SLAC GEN-1 system can only readout 2 modules, but it may be that it could readout 10-12 chips/~4 modules but this is likely to be slow. AK will investigate this.

GEN-1 is no longer being made. GEN-3 should be able to do 20/RCE board and this can be increased by connecting to several transceivers. GEN-3 should be available at end of 2013.

AK find out how many chips can a GEN-1 system accommodate and look at when the GEN-3 will be available.

Next meetings

Thursday 6th June, exceptionally at 9.30 UK Time via vidyo

This meeting is likely to be brief.

Topics for next meeting

• Update on bandwidth tape (YS)
• Status of FE-I4B probe card (YS/JM)

Thursday 13th June, 10am UK-time via vidyo

Topics

• DAQ status (AK)
• LETI status (TM)
• Hybrid flex status (IT)