Kaltis International. TC 6 Service Manual

THERMAL CYCLER

MODEL TC 6

Service Manual

Version 1.1

CONTENTS

1. Overview 1

1.1. Layout 1

1.2. Specifications 2

1.3. Operation 3

1.4. Installation 3

2. Structure 3

2.1. Upper case Assembly 4

2.2. Heated Lid Assembly 4

2.3. Sample Block Assembly 5

2.4. Chassis Assembly 5

3. Theory of Operation 6

3.1. Theory of Peltier-based Thermo Pump 6

3.2. Drive Board 8

3.3. Upper monitor board 8

3.4. Lower control board 8

3.5. Software Version 8

3.6. Electrical Wiring 9

4. Diagnosing Problems 10

5. Disassembling and Reassembling the parts 11

5.1. Removing Heated Lid 11

5.2. Removing Sample Block 11

5.3. Removing Lower control Board 11

5.4. Removing 20V Switch Power 11

5.5. Removing Driver Assembly 11

5.6. Removing Upper monitor Board 12

5.7. Removing LCD Display 12

5.8. Software Update 12

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Kaltis International. TC 6 Service Manual

1. Overview

1.1. Layout

Fig1 Front View

Fig2 Side View

Fig3 Rear View

1.2. Specifications

Input Power / 600Watts, 85VAC~265VAC, 47 to 63Hz
Sample Block Capacity / 0.2ml PCR tubes, 0.5ml PCR tubes, 8 or 12 strips, 96 well micro plate
LCD Display / 7” Full Touch Screen
Language / Bilingual: English and Chinese
USB Interface Memory / Unlimited with U-disk expansion
Ports
Ethernet Port / Connects up to 120 Thermal Cyclers to a computer
RS232 Port / Connects the instrument to a computer
Heated Lid Features
Height of Heated Lid / Fully adjustable lid, accommodates a wide range of PCR tubes and plates
Heated Lid Temperature / Programmable: 30°C~112°C
Auto Shut-off / Below 30°C of sample block temperature, or after finishing running
Other Specifications
Dimension(L×W×H) / 36*25*25cm
Net Weight / 7.3KG

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1.3. Operation

Refer to the User Manual for details.

1.4. Installation

Refer to User Manual for details.

2. Structure

The instrument consists of four sub-systems: Heated lid assembly, Sample block assembly, LCD display and control assembly & Chassis assembly. These four systems function together to rapidly and uniformly heat and cool the samples in the vials.

Fig4 Assembly View

2.1. Heated Lid Assembly

Heated lid assembly consists of thumb wheel, upper cover, handle, fixed latch, lid bracket, link plate, cover plate, lid cover and heated lid.

Fig. 5. Heated Lid Assembly

Sample Block Assembly

Sample block Assembly consists of the block plate, sample block, thermistor, peltier thermal pump, block PCB and heat sink.

Fig. 6. Sample Block Assembly

2.2. LCD Display And control Assembly

LCD display and control assembly consists of the screen case, vent case, touch screen, screen plate and MCU control board.

Fig. 7. LCD Display Control Assembly

2.3. Chassis Assembly

Chassis assembly consists of the power switch, driver board, fan, chassis, air duct, air duct support, left board, right board, table board, spring support, etc.

Fig.8. Chassis Assembly

3. Theory of Operation

Thermal cycler functions as a user programmable, temperature controlled sample block. The user interface of the electrical system allows the user to enter the thermal cycler run parameters, including time and temperature parameters. The electrical system and temperature sensors located in the sample block ensure that the temperature of the sample block corresponds to the user-programmed information. The sample block assembly holds the tubes containing the PCR sample.

The heated lid of the cycler is placed over the PCR vials during a reaction, preventing sample evaporation, condensation buildup, and increasing heat transfer by pressing against the sample tubes, thereby pushing these firmly into the wells of the sample block. Because the heated lid can be moved upward and downward by rotating a thumb-wheel, the lid will adapt to most PCR tubes and micro plates. The sample block is heated and cooled by a peltier type thermo pump.

The CPU module on the CPU main PCB collects the temperature from 8 thermistors, positioned in sample block, and calculates the output to a PWM electronic driver. A controlled current then flows into the peltier thermo pump to heat and cool the sample block.

The peltier thermo pump helps to produce a thermal cycler that is small in size, low in weight, reliable, safe for environment and with precise temperature control.

For the gradient thermal cycler, the thermo pump not only delivers sufficient power for heating and cooling, but also produces one dimension of the temperature gradient on the sample block, as needed. Three (3) thermo pumps under the sample block are used to achieve the gradient function. These thermo pumps work independently and, when they hold at different temperatures, these results in a temperature gradient on the block. The gradient function helps to determine the optimum run conditions for the PCR.

3.1. Theory of Peltier-based Thermo Pump

The Peltier Effect was discovered in 1834 by French physicist named Peltier. Peltier type thermo pumps have only recently become practical with the development of semiconductor thermocouple materials. A peltier type thermo pump contains Bismuth Telluride semiconductor material, is heavily creates either an electron excess (N-type), or electron deficiency (P-type). The material is attached to electrical conductors and sandwiched between an insulating material, creating the thermal coupler.

In the cooling mode, DC current passes from the N-type to the P-type semiconductor material. The temperature of the interconnecting conductor decreases and heat is absorbed from the attached sample block. This heat absorption occurs when electrons pass from a low energy level in the P-type material through the inter-connecting conductor to a higher energy level in the N-type material. This additional energy is absorbed by the electrons in the form of the thermal energy from the sample block.

The absorbed heat is transferred through the semiconductor by electron transport and is liberated through the heat sink when the electrons return to a lower energy level in the P-type semiconductor. The heat is dissipated by a fan mounted under the heat sink.

When heating is required, the D.C. current is reversed to the thermo pump. DC current will pass from the P-type to the N-type semiconductor and electrons will transport heat from the heat sink and transfer it to the sample block.

Driver Board

The Driver board has three-way outputs. These drivers receive D/A output voltage signal and heat/cool enable digital signal from lower control board. Through IC 3842 current converter and LC filter, they output controlled D.C. current to left, middle and right of three groups of thermo pump.

3.2. MCU Control Board

The MCU Control Board contains an LCD control (with MICR02440 for MCU) and operation control component (with ATmega128 for MCU),

The LCD control component contains an LCD interface, Ethernet part, USB port, RS232 port, etc.

The operation control component contains an AD/DA convertor, sensor port, fan port, lid port, RS232 port, etc.

LCD control component connect with the touch screen, by detecting input information from the touch screen, and communicating with the operation control part in order to control thermal pumps, heated lid and fan control, etc. At the same time it displays all running information from the terminal on LCD screen.

3.3. Software Version

The different software versions for different model are shown in the table 1.

Model / A300
Software Version / VER3.3.1
Function / With Gradient

3.4. Electrical Wiring

3.5. Fig12 Electrical Diagram

4. TROUBLE SHOOTING

No. / Error or Message / Cause / Action
1 / No display and no fan sound when power is on. / a. Power failure.
b. Power cord disconnected.
Switch power failure / a. Check line voltage and adapter.
b. Connect power cord.
C. Power off, ask for service.
2 / Abnormal vibrating noise. / Unstable bench
Uneven Bench
Loose case screw / Change the bench
Level / Change the bench plane
Fasten the screw
3 / Normal display but heating & cooling terminated. / Thermal pump failure / Shut off the power and call service
4 / No display but fan is moving when power on. / LCD failure or fan motor failure / Shut off the power and call service
5 / LCD displays:
History Power Lost! / Power off when protocol is running.
Power cord unreliable.
Poor quality of power outlet. / Cycler is OK, press any
key to cancel this
message.
Use reliable power cord
Use good quality power outlet
6 / Instrument heat normal but could not reach to the target temperature. / Incubate at 4°C for longer / too much condensation. / Open heated lid bonnet, let
the instrument incubate at
93°C for 30 min..
Modify 4°C infinite to 10°C infinite.
7 / LCD display:
Instrument failure!
Error code：01 / Instrument failure:
Sensor error / Power off, ask for service.
8 / LCD display:
Instrument failure!
Error code：02 / Instrument failure:
Ambient temperature is too high / Ambient temperature is too high, Instrument is protected. When the Ambient temperature drops to 30Deg.
9 / LCD display:
Instrument failure!
Error code：03 / Instrument failure:
Sink temperature is too high / Power off, ask for service.
10 / LCD display:
Instrument failure!
Error code：04 / The sample block type does not match the instrument. / Power off, ask for service.
11 / LCD display:
Instrument failure!
Error code：05 / Can't locate the SD card. / Power off, ask for service.

5. Disassembling and Reassembling the parts

5.1. Removing Heated Lid

Unscrew the four M4 Hex screw connecting upper case and chassis assembly, two in front of instrument, two on rear. Disconnect the wires between upper monitor board and lower control board. Lift the upper case and carefully lay it on the chassis side. Disconnect the four wires connecting heated lid assembly and sample block aided with flat screwdriver. Rotate the thumb-wheel to move heated lid downward, until it detaches from the plastic cover, take the four wires connecting heated lid off the shaft support, and free the heated lid. Replace a new heated lid and reverse previous steps to reinstall it. Pay attention to the correct connection of the four wires connecting the heated lid and sample block.

5.2. Removing Sample Block

The same procedure as above: Disassemble the upper case and chassis, disconnect the four wires between heated lid and sample block, move away the upper case. Unscrew another two M4 screws connecting the support bracket and sample block. Note: Never let the washers on the support bracket drop into chassis assembly. Disconnect several sets of wires connecting sample block and chassis assembly aided with a flat screwdriver. Replace a new sample block and reverse previous steps to reinstall it.

5.3. Removing Lower control Board

The same as above mentioned, disassemble the upper case and chassis, disconnect the wires between heated lid and sample block, use a straight edge screwdrivers to disconnect the power wires, wires between lower control board and heated lid, wires between lower control board and driver board, wires of RS232 port from chassis back, unscrew six pieces of M3 cross screws, move away lower control board. Replace a new lower control board and reverse previous steps to reinstall it. Note: usually it need to be re-calibrated the temperature if you had replaced the lower control board.

5.4. Removing 20V Switch Power

The same as above mentioned, demount upper case and sample block. Lift the upper case and carefully lay it on the chassis side, unscrew four pieces of M4 Hex screw, take out the 20V switch power, disconnect the wires. Replace a new switch power and reverse previous steps to reinstall it.

5.5. Removing Driver Assembly

The same as above mentioned, demount upper case, sample block, lower control board and switch power, unscrew six pieces of M3 cross screws which fixed the drive board on chassis back, demount the drive board, disconnect related wires, replace a new drive board and reverse previous steps to reinstall it.

5.6. Removing Upper monitor Board

Demount upper case assembly, make the LCD screen face to the surface of the table (underlay a soft mat to avoid scratch). Unscrew four pieces of M3 cross screw which fixed the upper monitor board and LCD screen. Demount the upper monitor board and disconnect related wires, replace a new drive board and reverse previous steps to reinstall it.

5.7. Removing LCD Display

The same as above mentioned, demount upper monitor board assembly, unscrew four pieces of M3 cross screw, demount LCD support bracket, unscrew four pieces of M3 cross screw, take down the LCD screen and disconnect related wires, replace a new one and reverse previous steps to reinstall it.

5.8. Software Update

Disassemble the upper case and chassis assembly, lift the upper case and carefully lay it on the chassis side. You will see a MCU module on it. Take off the MCU module and replace a new module with updated software. Reverse previous steps to reinstall the instrument. Note the pin number on MCU module must have same number on the socket of MCU Main PCB.

Note: Before disassembling and reassembling the parts, disconnect the power and pull out the power cord from the electrical outlet.