Best Student Paper Contest
Fudan-Novellus International Copper Interconnect Technology Symposium
Paper Due: February 28, 2008
The first Fudan-Novellus International Copper Interconnect Technology Symposiumbest student paper contestis organized by Fudan University-Novellus Systems Interconnect Research Center. The Fudan-Novellus International Copper Interconnect Technology Symposium provides a platform for university students, researchers, and industry engineers in semiconductor processing, advanced materials and copper interconnect technology to discuss exciting new semiconductor technology. It also offers good opportunity to connect China university studentsand researchers with worldwide semiconductor professionals.
Fudan-Novellus International Copper Interconnect Technology Symposium will be held once a year at beautiful Fudan Zhangjian Compus. For Year 2008 symposium,
Fudan University-Novellus Systems Interconnect Research Center will sponsor a best student paper contest in the following Copper Interconnect area:
- Novel technology for semiconductor processing and interconnect
- Cu/Low k Integration
- PVD/CVD/ALD barrier and seed layers for copper for 45nm and beyond
- CMP material and process technology
- Dry Processing (Trenches & Damascene structures, dry cleaning processes, plasma induced damage, etc.)
- Advanced Dielectric materials (low k, high k, ARCs, etc.) and deposition processes development
- Advanced electrofill technology
- Reliability of metallization
- Advanced patterning process
Contributed papers addressing all aspects of interconnect technology will be rigorously solicited by paper contest committee. The best student paper contest committee is consist of being invited speakers of next year symposium and Novellus professionals.Papers are welcome all currently registered students from universities, academia or research institutes around China.
Deadline: February 28, 2008
Papers must be submitted electronically and must be 3 pages in length inclusive of all illustrations, charts and tables. Authors should send only original, unpublished work. Paper submissions that have been previously presented or published will not be accepted. Contact information for each author must be listed on the first page of the paper: name, affiliation, city and province. Papers must be written in English. Authors with accepted papers for presentation at year 2008 symposium will be notified in March, 2008.
Selected paper will be awarded:1 gold award with RMB 5000, 2 silver awards with RMB 3000 each and 3 bronzeawards with RMB 1000 each.
Please submit abstracts by February, 2008 to:
Helen Xu