ANNEXURE – 1

QA REQUIREMENTS

1 / PART NO. /
  1. 4050BEDIE2HR ( as per ESCC No. 9202046 )
  2. 4013BEDIE2HR ( as per ESCC No. 9203023 )

2 / QUALITY SPECIFICATIONS /
  1. Space grade die meeting the requirement of ESCC 9000.
  2. Manufacturer of the die shall be qualified for the packaged device
as per ESCC 9000.
  1. The die shall be from the same wafer fab as used for packaged qualified device and in strict compliance to PID (Process Identification Document)
  2. Wafer Lot Acceptance testing shall be done as per ESCC 9000 requirements.
  3. Wafer lot validation tests, including 1000-hour life test.
  4. Radiation Requirement:
  5. The die shall be Radiation Hardened.
  6. The devices shall perform satisfactorily upto Total Ionising Dose level of at least 100 K Rads
  7. RVT report for the lot shall be provided

OTHER REQUIREMENTS /
  1. Die shall be packed in ESD safe pack (preferably in packing of maximum 50 die in one package) with proper identification and marking of lot code and date code with QC approval. The package shall be preferably Gel pack. The pack shall be supplied in Nitrogen purged or vacuum sealed bag.

4 / Information along with the quote /
  1. ESCC data sheet
  2. Die Information including
- Wafer size
- Die size
- Die thickness
- Back metallization
- Top metallization
- Recommended bonding wire diameter
- Die pad size
- The die pad identification with the corresponding die lay out.
  1. Manufacturer Space grade die process and test document.
  2. Authorisation certificate from the manufacturer, including the details for authorization for product, start date and validity period of authorization if the quote is not directly from the manufacturer.
  3. Data pack details and quote for optional test or data pack if any.

5 / Documents / Reports required along with the supply of Components /
  1. Certificate of conformance including (Wafer lot traceability, Detail specification used for associated packaged parts, manufacturing lot traveler reference for the die item, Manufacturing lot traveler reference for the qualification lot.
  2. Space grade die datapack

PLEASE SUPPLY THE COMPLIANCE DETAILS TO THIS REQUIREMENT PROVIDING NECESSARY SUPPORT DOCUMENTS ALONGWITH THE QUOTE.

QA Annexure AHST 2017E4691 die DA.docx