Press Release
Contact:
Malte Borges
Tel. +49 (0)5131 7095-327
Fax +49 (0)5131 7095-90
Garbsen, 18.04.2011
LPKF
Laser & Electronics AG
Osteriede 7
D-30827 Garbsen
www.lpkf.com
Board of Managing Directors
Dr. Ingo Bretthauer (CEO)
Bernd Lange (CTO)
Kai Bentz (CFO)
Shares:
Prime Standard
ISIN 0006450000
Print free of charge, copy requested
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Product and brand names are trademarks of LPKF Laser & Electronics AG, registered among others at the US Patent and Trademark Office: LPKF® and the company logo, # 2,385,062 and # 2,374,780;
Solarquipment®, # 3,494,986; ProConduct®,
# 3,219,251; Allegro®, # 3,514,950.
LPKF's 3D prototyping solution at SMT
At the Hannover Fair a pre-production model of the new LDS laser structurer generated a great deal of interest. LPKF will present the complete solution for prototypes and small series production, using the LDS process, for the very first time at SMT in Hall 6, Booth 320.
Until now there has been a gap between the layout and production of three-dimensional carrier structures: the prototyping of molded interconnect devices (MID) has thus far been expensive and time consuming. LPKF Laser & Electronics AG (LPKF) wants to change exactly this with a new process based on three developments from their laser laboratories in Garbsen. With Laser Direct Structuring (LDS), high-quality smart phone antennas are integrated on existing plastic parts, for example, and this completely re-places conventional antennas. With the LDS method a laser beam activates the surface of the component; in subsequent electroless baths the desired metal layers are constructed.
The starting point is any three-dimensional component. For this purpose plastic prototypes from 3D printers, for example, are suitable. These components are coated with the laser-activatable LPKF ProtoPaint LDS lacquer. Here, the LPKF Fusion3D 1000 takes on the structuring. Unlike large production machines, it uses a single processing head. It has a large work platform, so that users can integrate their own fixture and handling systems. Structuring is done, if necessary, in successive steps. A pilot laser helps by establishing the optimal component position.
After structuring, electroless metallization takes place. This hardly differs from the series parameters and can occur in beakers in a laboratory. LPKF even offers a coordinated, reliable process for the metallization.
"With LDS prototyping, we have closed the gap between design and production. The prototypes allow realistic conclusions about standard parts. At the same time, the process is so flexible that different layouts can be tested without high costs or delays," explains Nils Heininger, Director of the Cutting and Structuring Laser Department at LPKF.
With 3D MID prototyping, LPKF creates an affordable entry in the development of three-dimensional interconnect devices.
Printed circuit board prototyping and UV cutting
Visitors to SMT not only obtain information about the prototyping of 3D circuits, but also get their money worth in reference to conventional flat circuit boards. LPKF will be introducing a new series of circuit board plotters. These systems can easily be upgraded from an entry level to top-level system, and can be extended with options such as: 15 point tool change, milling width adjustment, vacuum table, the vision tool, and a solder paste dispenser.
LPKF is presenting the MicroLine UV cutting systems in a complete production line at the IZM joint booth in Hall 6, Stand 434. These systems cut assembled and unassembled PCBs with high precision, without mechanical stress, and into any desired contours.
About LPKF
LPKF Laser & Electronics AG manufactures machines and laser systems used in electronics fabrication, medical technology, the automotive sector, and the production of solar cells. Around 20 percent of the workforce is engaged in research and development.
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