IMPACT Conference 2009 and International 3D IC Conference

IMPACT Conference 2009 and International 3D IC Conference

Early bird price ends on Oct. 9

Give you novel technology of 3D IC, Packaging, Thermal management and PCB

The 4thInternational Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2009)broke the record this yearagain which has become the biggest world-class Conference in this field.For this reason, IMPACT is proud to announce that ithas solicited more than220 papers from 12 countries on aspects of Microsystems, Packaging, Assembly, Thermal Management, Materials and PCB technology. Because more and more end-products widely apply to 3D IC technology, Semiconductor Industry Promotion Office (SIPO) will hold 3D IC Conference at the same time. Consequently, IMPACT Conference 2009 and International 3D IC Conference willbe held together at Taipei Nangang Exhibition Hall during on Oct. 21-23.

Integrated with industrial, academic and researching resource from IEEE CPMT-Taipei, ITRI, IMAPS-Taiwan, I-Shou University, SMTA, SIPO and TPCA,this Conference has attracted many participants from different areas. This year, the theme of IMPACT Conference is IMPACT Your Future: Integration, Efficiency, & the Eco-Friendly.For increasing Conference diversified contents, Organizer has invited General Manager of ASE Group, Dr. Ho-Ming Tong to give a keynote speech - “IC packaging as a Supply Chain Enabler & Future Trends” in opening ceremony. He will bring up a new idea which is under the impact of global tsunami and customer expectations in cost and higher system integration, IC packaging industry consolidation has hastened. In the meantime, Mr. Doug Bokil (President of IMPAS) will deliver a speech“Microelectronics Packaging-Design to Manufacturing”. His presentation will begin with an outstanding viewpoint of the interdependency of Speed, Power and Thermal issues in mircroelectronics devices.Dr. Robert C. Phahl (VP, iNEMI Global Operations) will be invited to address “Thrust Areas for the Electronics Industry: Miniaturization and the Environment” on Oct. 22. On third day, Dr. Steven J. Koester, manager of the Exploratory Technology Group at the IBM will announce 3D IC technology. His topic is 3D Integration-Technology, Applications, and New Opportunities, which will bring novel solution. Organizer believes that this conference must bring latest technology and industrial viewpoint for every attendee.

This year, IMPACT invited three international enterprises, ASE, SPIL and Nan Ya Plastics Corporation to joinindustrial sessions. They will announce their latest invention by this occasion. With International 3D IC Conference and TPCA Show 2009 held in conjunction with, organizer hopes every participant from industrial, academic and researching areas has opportunity to learn about the latest technology.

Host welcomes your participation. More information, please refer to IMPACT website. ( If you register before Oct. 9, you will enjoy early bird price. Please grasp the last chance to attend international technologic stage. Furthermore, organizersoffer a special plan called “School Benefits” for teachers who bring at least 5 students himself can get student fee. IMPACT reminds you to grasp the best opportunity to get current technologic trend of 2010.

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Date：Wednesday-Friday, October 21-23, 2009

Venue：Taipei Nangang Exhibition Hall, Taipei, Taiwan

Deadline of Early Bird：October. 9. 2009.

Deadline of Online Registration：October. 16,2009

IMPACT website： ;
TPCA Show website：

Contact Window：MS. Sylvia Yang

TEL:+886-3-3815659 #405 FAX:+886-3-3815150 Email: