SUBJECT DESCRIPTION FORM
Subject title: Guided Study in Micromachined Capacitive Pressure Sensor
Subject code: ISE6835
Credit value: 3
Responsible staff and department:
Dr C.H. Cheng (ISE)
Pre-requisite: (Subject title and code no, if any)
Nil
Recommended background knowledge:
Basic knowledge in electronic devices and MEMS fabrication experience may have advantage.
Mutual exclusions:
Nil
Learning approach:
The subject is conducted in Mode II. Mode II is operated for guided study subjects with no relevant MSc subject/short course available. The student is required, under the supervision of the subject supervisor, to read specified monographs, journal publications and books. The student and the subject supervisor will meet once per week to discuss the progress in the subject. Coursework such as the literature survey reports and the presentations would be included. At the end of the semester the student will be examined, normally both orally and in written form.
Assessment:
Model II:
Coursework: 40%
Examination: 60%
Objectives:
1. To understand the working principle of a Micromachined Capacitive Pressure Sensor.
2. To investigate the current capacitive pressure sensor technologies.
3. To improve the current capacitive pressure sensor performance with novel structures.
4. To design and fabricate the capacitive pressure sensors with improved performance.
Keyword syllabus:
· Capacitive pressure sensor working principle
Parallel capacitor, Electrostatic force, Membrane deflection, DC bias
· Current capacitive pressure sensor technologies
Capacitive pressure sensor structure, design, and fabrication
· Improvement of capacitive pressure sensor performance
Novel capacitive pressure sensor structure, Concave bottom electrode, Capacitance improvement
· Capacitive pressure sensor fabrication
Mask design and making, Photolithography, Metal sputtering, Electroplating, Wet & dry etching
Learning outcomes:
1. To possess basic knowledge of capacitive pressure sensors. (Objective 1)
2. To be able to search and understand current pressure sensor technologies. (Objective 2)
3. To apply different fabrication techniques to realize novel micro structures. (Objective 3)
4. To implement novel capacitive pressure sensors by micro fabrication techniques. (Objective 4)
Indicative reading list and references:
[1] Jeahyeong Han and Mark A. Shannon, “Smooth Contact Capacitive Pressure Sensors in Touch- and Peeling-Mode Operation,” IEEE Sensors Journal, Vol. 9, No. 3, March 2009.
[2] Y. Hezarjaribi, M.N. Hamidon, R.M. Sidek, S.H. Keshmiri, R.S.A. Raja Abdullah, A.R. Bahadorimehr, “Analytical and Simulation Evaluation for Diaphragm’s Deflection and its Applications to Touch Mode MEMS Capacitive Pressure Sensors,” Australian Journal of Basic and Applied Sciences, 3(4): 4281-4292, 2009.
[3] Kenichi Takahata, and Yogesh B. Gianchandani, “A Micromachined Capacitive Pressure Sensor Using a Cavity-Less Structure with Bulk-Metal/Elastomer Layers and Its Wireless Telemetry Application,” Sensors 2008, 8, 2317-2330.
[4] Cheng-Ting Ko, Sheng-Hsiang Tseng, and Michael S.-C. Lu, “A CMOS Micromachined Capacitive Tactile Sensor With High-Frequency Output,” Journal of Microelectromechanical Systems, Vol. 15, No. 6, December 2006.
[5] J. Du, W.H. Ko, M. Mehregany, and C.A. Zorman, “Poly-SiC capacitive pressure sensors made by wafer bonding”, Proceedings of the 4th IEEE Conference on Sensors, Anaheim CA, October 31 to November 3, 2005, pp. 1268-1270.
[6] P.D. Dimitropoulos, C. Kachris, D.P. Karampatzakis, G.I. Stamoulis, “A new SOI monolithic capacitive sensor for absolute and differential pressure measurements,” Sensors and Actuators A 123–124 (2005) 36–43.
[7] M. Zagnonia, A. Golfarelli, S. Callegari, A. Talamelli, V. Bonora, E. Sangiorgi, M. Tartagni, “A non-invasive capacitive sensor strip for aerodynamic pressure measurement,” Sensors and Actuators A 123–124 (2005) 240–248.
[8] Sung-Pil Chang∗, Mark G. Allen, “Demonstration for integrating capacitive pressure sensors with read-out circuitry on stainless steel substrate,” Sensors and Actuators A 116 (2004) 195–204.
[9] Jason Shih, Jun Xie, Yu-Chong Tai, “Surface Micromachined and Integrated Capacitive Sensors For Microfluidic Applications”, The 12th International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers 2003), Boston, USA, June, 2003, pp.388-391.
(December 2010)