Journal of Imaging Science and Technology

Call for Papers

Special Issue on Recent Advances inFlexible and Printed Electronic (ICFEP2017)

Summary:

Printing technology has traditionally been adopted for printing newspapers, magazines, packaging,and foils with high throughput. A recent advancement in the field is to utilize printing technologies in such applications as “Printed Electronics”, which has rapidly progressed from the initial research and invention stage to the product commercialization stage. Compared with current state-of-the-art silicon-based electronics, printed electronics enjoythe advantages of lower process cost and better device performance.Built ona variety ofpromising and novel manufacturing technologies withmultiple applications, printed electronics represents a multibillion-dollar marketthatwill empower the next wave of industrial revolutionvia enabling a variety of innovative products made from low cost electronic paper or plastic film such as followings:

  • electronic clothing, lighting and books
  • the biodegradable and disposable mobile phone, iPod and laptop
  • cars that glow in the dark
  • billboard, poster, airport screen, packet of drugs and shelf sign with color display.

The International Conference on Flexible and Printed Electronics (ICFPE) highlights challenges, emerging processes and applications in printing process, materials and devices. It covers a broad range of topics in this field, including but not limited toinnovativeproduction processes, novel materials and devices, and other related technologies essential for improving printing performance.

This special issue will bring together leading scientists, researchers, and scholars in the domain of interest,and cover such research topicsasfundamental science, manufacturing processes, and industrial applicationsin relevant areas of flexible and electronic printing technologies.Submission guidelinescan be found in All submitted papers will be reviewed by two to three reviewers andselected based on their originality, significance, relevance, and clarity of presentation. The coverletter should indicate thenames of the authors and their affiliations, addresses, faxes, and e‐mails. The authors should submit full manuscripts electronically via by November 05, 2017.

The topics for special issue include, but are not limited to the following fields:

Fundamental subjects

  • Materials & Components
  • Equipment
  • Equipment (roll-to-roll, printing, coating etc)
  • Device Physics & Circuit Design
  • Electrical Measurement & Evaluation

Applications

  • Flexible Displays & Lightings
  • Sensors & Smart IT
  • Smart Textiles
  • Energy Harvesting

Emerging areas

  • 2.5D and 3D Printing for Electronic Applications
  • Wearable/Stretchable Electronics
  • Flexible & Printed Electronics for Transportation
  • Smart IT for Industry 4.0

Manufacturing

  • Additive manufacturing
  • Hybrid manufacturing
  • Scaling-up issues
  • Measurement and Reliability

Important Dates:

Submission deadline: November. 05, 2017

First-Round review date: January14, 2018

Submission of revised version: February14, 2018

Notification of acceptance: March14, 2018

Camera-ready due: April7, 2018

Publication date: May/June 2018 (tentative)

Guest Editors:

  • Prof. Kye-Si Kwon
  • Department of Mechanical Engineering,
  • Soonchunhyang University, South Korea
  • E-mail:
  • Prof. Jiyoul Lee
  • Pukyong National University, South Korea
  • Prof. Yong-Hoon Kim
  • Sungkyunkwan University, South Korea
  • Prof. Jihoon Kim
  • Kongju National University, South Korea

Page Charge:

Page charges in the amount of US$40/page, which is 50% of the regular charge, in partial support of the publication of the Journal and as agreed by the authors at the submission of thepaper, are due by date of publication.