XEROXHISPANICCOLLEGE LIAISON PROGRAM

SCHOLARSHP GUIDELINES

The Xerox Hispanic College Liaison Program provides funding to minority students enrolled in one of the technical sciences or engineering disciplines. This scholarship is available to full time students pursuing a career in engineering, math or science. Dollar amounts for scholarships vary from year to year (usually from $250 - $2,000). The actual amounts will be communicated at a later date. Scholarship requirements are listed below.

  • You must be a full-time student enrolled in a four-year institution.
  • Must be a sophomore or junior. Or a graduate student.
  • Have a GPA of 2.3 average or better.
  • At graduation you will receive a BS or MS in a technical science or an engineering discipline.
  • Have tuition (or tuition related) funding needs.
  • Be an active member of SHPE, MAES, SOLES, etc. campus chapter.
    (THIS MAY NOT BE REQUIRED - depends on campus participation)

To apply, follow each of the steps listed below:

Step 1:Fill out the Xerox Hispanic College Liaison Program application.

Step 2:Attach a copy of your resume.

Step 3:Complete a one or two page typed essay outlining the following topics.

· Professional organizations, i.e., SHPE, MAES, SOLOES, etc.

· Community projects and role you played

· Current higher education status

· Career goals

· Financial need for Achievements

· How you plan to help others like yourself in the future

· Any other information relevant to this application

Step 4: Submit the complete package to your Xerox Hispanic College Liaison Manager
or as directed.

The Xerox Hispanic College Liaison Manager, campus advisor or school official will notify recipients of the scholarship awards. If you do not hear from us, this will indicate that you have not been awarded the Xerox Hispanic College Liaison Program (HCLP) Scholarship.

Thank you for your interest.

Award / Application Deadline / Forms required / Winners Announced on
$250 to $2,000 / March 22, 2010 / Application, Resume & Essay / TBA – April 2010

2010- XEROXHISPANICCOLLEGE LIAISON PROGRAM SCHOLARSHIP

TO STUDENT: Please complete the following information based on the current school year. All applicants must be full-time students enrolled at a four-year institution to be eligible. Deadline for submission of this application, including resume and essay is March 22nd.
Note: NO APPLICATION WILL BE PROCESSED WITHOUT APPLICANT RESUME ATTACHED and COMPLETED ESSAY.
Last Name, First Name, Middle Initial / Social Security Number / Date
College or University AddressCity, State, ZipContact E-mail AddressContact Phone (Area Code)
1250 Bellflower Blvd.Long Beach, CA 90840(562)985-8014
Home Street AddressCity, State, ZipHome E-mail AddressHome Phone (Area Code)
Ethnic Background / Hispanic American Indian Black/African American
Caucasian Asian Other / Male
Female
Name of 4-year
Institution Attending / Cumulative GPA / Scale (e.g. 3.0 out of 4.0) / Expected Degree
BS MS PhD / Major Field of Study / Expected Date of Graduation
CSU Long Beach / 4.0
Are you currently (or were you ever) a Xerox Hispanic Liaison Program Scholarship recipient? Yes No
If yes, what year? / Have you ever worked at Xerox? Yes No If Yes, what Business Group and year?
Career Interests
Applicant’s signature DATE
My signature above indicates that I authorize school officials to release the below information to The Document Company, Xerox for inclusion in my application for the Xerox Hispanic College Liaison Program (HCLP) Scholarship. All application material becomes the property of HCLP.
1.Cumulative GPA for the current school year ___ out of what scale (e.g. 3.0 out of 4.0) _4.0_ .
  1. Attach a one-page typed essay outlining why you need this scholarship and feel free to give details regarding your career interests.
  2. Turn in this application, your resume and your essay to your Xerox Hispanic Liaison Program Manager or as directed.
Mail this application to:
Victoria Watson
Mail Stop ESAE-323
555 South Aviation Blvd
El Segundo, CA90245

Must be Postmarked no later than;

March 22, 2010