A d v a n c e d O p t i c a l O v e r l a y M e t r o l o g y
THE ARCHER 100™ OVERLAY CONTROL SYSTEM, based on the industry proven Archer™ platform, meets stringent performance and cost of ownership (CoO) requirements for 45nm design rules and below. Fully redesigned optics, tighter stage tolerances, new imaging and illumination modes, shorter MAM time, enhanced algorithms and built-in diagnostics combine to deliver the high levels of process robustness and productivity needed to address increasingly tighter overlay error budgets. Leveraging KLA-Tencor’s patented AIM™ technology and Archer Analyzer™ software, the Archer 100 enables in-chip metrology and in-field analysis for advance dispositioning and higher-order overlay control. A smart new automatic recipe optimization (ARO) sequence improves ease of use and tool utilization, enabling relatively unskilled operators to quickly create high quality recipes offline.
Improves Overall Production CoO The Archer 100 increases through-
Satisfies Tighter Overlay Budgets The Archer 100 is a fully put to over 80 wafers per hour (production sampling) and delivers 20% extendible optical overlay metrology system designed to keep pace with faster move-acquire-measure (MAM) time over existing tools. This enables increasingly challenging lithography control needs. Tighter specifications rapid intra-ﬁeld measurement and increased sampling rates, key requirements of the completely redesigned optics system significantly reduce lens for improving yield in immersion lithography. Comprehensive tool diagnostics aberrations, enabling 30% improvement in total measurement uncerminimize downtime risk, while the new optics design accelerates tool installatainty (TMU) and site-by-site matching. The new XYZ stage positioning tion time. Since offline recipe creation also saves tool time, these factors system offers tighter stage tolerances, and the imaging system features
– along with options such as the triple load port – enhance tool utilizaa new camera with high signal-to-noise ratio (SNR), further ensuring tion by more than 20% over the previous generation. The Archer 100 measurement reliability and repeatability. platform is designed to allow a smooth upgrade path to support future technologies, such as double-patterning lithography (DPL) at 32nm.
Improves Process Robustness The redesigned wafer alignment system delivers sharper optical resolution and contrast. A new illumination
..system with extended spectrum and narrow bandwidth capabilities
Provides Enhanced Analysis Capabilities Archer Analyzer is a fully automated, real-time overlay analysis software option that incorporates improves the measurement signal of low contrast and asymmetric layers, advanced algorithms and data filters to analyze Archer 100 results onmaking the Archer 100 suitable for challenging high-volume manufacturtool. This capability helps to determine if a given wafer lot has met ing (HVM) applications such as amorphous carbon layer (aCL) measurepredetermined parameters, and provides users with critical litho cell ments in memory production. Improved low-contrast layer measurements corrections. Wafer lot dispositioning results and stepper correction data enable higher accuracy and robustness for better stepper matching and helps lithographers to reduce unnecessary rework and quickly address lithography process control. variations in lithography tool performance, minimizing cycle time and yield loss. Archer Analyzer uses the same factory automation interface as all Archer family systems, enabling easy integration into a 300mm fab network.
Enables Higher-Order Overlay Control Using Smaller AIM Targets
AIM technology, with its periodic imaging-based grating targets, enables in-chip metrology and in-field modeling required for achieving improved in-die analysis. This powerful capability helps in advance dispositioning and process control, providing a clearer understanding of unmodeled
Enables ‘On Product’ Monitoring of Focus/Exposure The MPX™
Focus/Exposure Line Monitor provides an innovative methodology to errors and better implementation of dense inter-field and intra-field monitor photo excursions of focus and exposure on production wafers. sample plans. Archer 100 takes the field-proven AIM technology to the As an option on the Archer 100, MPX improves overlay tool CoO as a next level, where the denser structure of enhanced, smaller micro-grating single solution that monitors all stepper controls while providing high
(µAIM™) targets increases information content with reduced residuals throughput with rapid optical measurements. MPX capitalizes on a for higher process robustness. unique capability to separate exposure from focus for accurate process monitoring while providing real-time focus and exposure metrology.
Greatly Simplifies Ease of Use The ARO feature is a new productivityboosting recipe training sequence that allows less experienced operators to automatically create optimal recipes offline. Without impacting tool
Comprehensive Process Control The Archer 100 is fully integrated with KLA-Tencor’s leading yield management software products, includoperation, ARO quickly yields recipes with the best possible performance ing Archer Analyzer stepper analysis, RDM+ recipe data management, and higher success rates. This eliminates the need for operator intervenand iSupport™ remote assistance and tool maintenance, to provide tion and any chance of human errors, ultimately freeing up valuable comprehensive optical overlay metrology process control. All software engineering resources in the fab. components have been enhanced in several key areas, including measurement and focus algorithms, recipe setup automation, runtime auto-
Optimizes Recipe Management The integrated Recipe Database mation, and analysis. The accelerated production ramp of the Archer 100
Manager (RDM+) software gives users offline access to a centralized allows metrology and lithography engineers to more effectively manage database to leverage previously proven recipe components. This reduces tightening overlay error budgets, which have a direct impact on device setup time, and increases reliability and traceability of measurement performance, lithography performance and overall yield. recipes. The improved Waferless, Imageless, and Automation Recipe
Creation (ARC) modes enable full automation of the recipe creation process across all KLA-Tencor overlay metrology systems. To ensure recipe quality, RDM+ offers powerful new options such as Recipe Compare and Recipe Validation for HVM recipe management and control. A d v a n c e d O p t i c a l O v e r l a y M e t r o l o g y
• Signiﬁcantly reduces TMU (by 30% over previous generation) to satisfy tighter overlay error budgets for ≤45nm design rules
The Archer 100 effectively solves the problem of lower contrast measurements, increasingly seen in such applications as amorphous carbon layer (aCL) hard mask films. A new illumination system option improves measurement accuracy and robustness for 45nm and below overlay error budgets in HVM memory production.
• Improved tool utilization and CoO increases productivity by 20% over previous generation
Smaller micro-grating (µAIM) targets further reduce model residuals by accurately representing overlay error within the lithographic field, ensuring higher-order overlay control.
• Micro-grating (µAIM) targets enable in-ﬁeld modeling and higher-order overlay control; with increased process robustness
‹ꢀBright Field Critical Dimension (BF CD)
The BF CD measurement calculates the distance between one feature and another. BF
CD measurements can be horizontal or vertical, with their specific direction determined by the orientation of the measured feature. Using the Archer 100, the BF CD capability can also be effectively applied for measuring “Fuse Box” structures with high topography.
• Enhances measurement of low-contrast targets; especially beneﬁts HVM memory
• Automatic Recipe Optimization (ARO) enables faster, easier recipe creation
Using Archer Analyzer, increased intra-field sampling with µAIM targets enables more accurate production modeling and analysis of overlay errors.
The industry leading specifications of the Archer 100 platform increase the overall equipment effectiveness of lithography cell tools. The tool reliably and accurately measures exact process conditions at increased sampling rates, needed for better stepper matching and lithography process control in today’s emerging immersion lithography applications. The Archer 100 platform is designed with the flexibility and extendibility to meet the 32nm requirements of R D fabs, including next-generation strategies such as double patterning lithography (DPL).
• Recipe Database Manager (RDM+) reduces setup time, and increases reliability, success rate and traceability of measurement recipes
ARO ARO ARO ARO
• Extendible platform addresses immersion technology challenges, and provides clear upgrade path for next-generation double patterning lithography
Ease of use is greatly simplified via new features such as the ARO sequence and RDM+ , which significantly reduce setup time, as well as increase the quality, reliability and traceability of measurement recipes.
KLA-TENCOR: ACCELERATING YIELD
KLA-Tencor’s portfolio of solutions includes the industry’s broadest ﬂeet of advanced inspection and metrology systems, which enables customers to capture yield-critical defect and metrology data. It also includes the sophisticated software to turn that data into quick corrective action. Finally, it includes the expertise to help customers rapidly understand and resolve complex manufacturing problems so they can reap the ﬁnancial and market rewards associated with faster time to market and increased product yields.
Customer service and support are an integral part of KLA-Tencor’s yield optimization solution. Our vast customer support organization services our worldwide installed base and is responsible for customer support following shipment of equipment and software. Services include system installation, secure online monitoring, on-site repair, telephone support, relocation services, and selected post-sales applications.
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© 2006 KLA-Tencor Corporation. All brands or product names may be trademarks of their respective companies. KLA-Tencor reserves the right to change the hardware and/or software speciﬁcations without notice.
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