Surface Analysis and nano-Imaging (SAL)
Instrumentation (co-located MRSEC shared facilities)
w JEOL JEM-2800 S/TEM with ultrafast EDS (7/14)
w Kratos AxisUltra imaging XPS / Auger / ISS
w FEI Helios Nanolab 650i hi-res db-FIB, EBL
Pt, W, C dep; XeF2, I2, H2O enhanced etch
w FEI Quanta 600 FE-ESEM w/ EDX & EBSD
w EDAX Eagle III Microspot XRF (mprobe & mapping)
w Bruker ICON-PT AFM w/ Peak Force QNM
w Woollam V-VASE spectroscopic ellipsometer
w ZYGO NewView 5032 optical profilometer
w Bruker Discover D8 thin film X-ray Diffraction
w Olympus FV-1000 Scanning laser confocal
Excitation sources: 405, 457, 488, 514, 568, 633, 748nm
Sample Preparation & Metrology
w TEM prep tools
w Allied slow speed saw, manual and multiprep polishing
w Reichert Polyvar Met digital microscope (BF, DF, DIC)
w Fischione 1050 SEM broad beam Ar ion mill surface prep
w Gatan PECS – SEM prep (C, Pt, Au, Pd, Cr dep)
w Gatan Precision Ion Polishing (PIPS – TEM prep)
w Vertex 220 microVu Digital Comparator
w Micro fiducial laser cutter for correlative multiscale microscopy: 355, 532, 1064 nm; 1.2-15mJ
Utah Nanofab / USTAR Cleanroom
DESIGN & SIMULATION SOFTWARE
w L-Edit CAD
w Cadence
w AutoCAD
w Link-CAD DXF/GDSII/CIF/PG/EM conversion tools
w Sandia SUMMiT™ design tools
w SASS JMP statistical design of experiments (CADE)
w ANSYS finite element analysis
w COMSOL
LITHOGRAPHY
Pattern Generation
w Heidelberg µPG 101 Laser Pattern Generator
o 3 µm minimum feature size
o Direct write and grayscale capabilities
Pattern Transfer
w Suss MA1006 front and backside contact aligner
w EVG EV-420 front and backside mask aligner
w OAI Model 200 contact aligner (x2)
w Spinners, ovens, hot plates, hoods, SRDs, . . .
w LOR 7B, AZ 9620, Shipley 1813, nLOF 2020
w YES HMDS vapor prime vacuum ovens
THIN FILM DEPOSITION
Sputtering
w TMV SS-40C w/ Ti, Ti/W, Cr, Au, Pt, Ir
w Denton Discovery 18 with three 3” cathodes, RF/DC, substrate rotation and heating
w PE 4400 with 8" cathodes, In2O3, Ga2O3, NiO, Mo (pending)
Evaporators
w Denton e-beam DV-SJ/20C with 4 hearths
w CHA 600 e-beam evaporator
PECVD
w Oxford Plasmalab 80+: a-Si, Si3N4, SiONx, SiO2
CVD
w SCS PDS 2010 Parylene-C
ALD
w Cambridge Fiji F200 w/ thermal & plasma dep modes, H2O preclean (Pt, HfO, ZnO, Al2O3, SiO2, , TiO2, MgO, WO3)
FURNACES and DIFFUSION
LPCVD
w Expertech TEOS / LTO / PSG / low-stress Si3N4, a & phos-polySi
w Canary Noble 4: a-Si, poly-Si, stoichiometric Si3N4
Atmospheric
w Canary Noble 4 wet/dry oxidation; phos diffusion
w Lindberg 100 mm annealing furnaces
w Blue-M box furnace with N2 purge
w ProTemp wet/dry oxidation with DCE (pending with RTP)
w MPTC RTP 600XP with O2, N2, Ar, H2 forming gas, 200-1250C
ETCH
RIE and DRIE
w STS Aspect ICP DRIE: time-multiplex Si etch
w Oxford Plasmalab 100+ ICP time-multiplex & cryo DRIE
w Oxford Plasmalab 80+ multipurpose
w Technics PEII H2O, O2 descum & resist strip
w Xactix Xetch XeF2 silicon isotropic etch
Wet Chemical
w Bold & WAFAB wet benches (x6) acids, bases, organics
MICROMACHINING
w Optec Micromaster KrF laser polymer machining
w Reel-Tech LM4000 Nd-YAG laser micromachining
w Custom KOH bulk Si etch station
POLISHING/PLANARIZATION
w Strasbaugh 6EC 100 mm CMP
PACKAGING
w EVG 520IS Wafer bonder
o hot embossing
o thermal bonding
o anodic bonding
w Disco DAD 641 dicing saw (std or UV tape)
w Disco 3220 dicing saw (std or UV tape)
w MEI wedge wirebonder with Au and Al
w UTI 9101 wire bond pull tester
TEST AND CHARACTERIZATION
Cleanroom Metrology
w LEO 440 SEM
w n&k NKT 1500 thin film analyzer
w Nanometrics NanoSpec 3000 film thickness
w Magnetron Instruments 4-point probe
w Polyvar Met with DIC + many optical microscopes
w Nikon Optiphot 88 with BF, DF, DIC
w Nikon V12A optical comparator
w Infinivar Infiniprobe
Mechanical/Structural
w Tencor P-10 and P-20 stylus profilometers
w Tencor Flexus 2320 film stress
ELECTRICAL / MAGNETIC TESTING
w Verigy SOC IC tester
w Microsense FCM-10 vibrating magnetometer
w Keithley 4200 parameter analyzer with 4 SMUs
w Probe stations with temperature chuck
PROTOTYPING AND MICROFLUIDICS LAB
w Laserstar 1900 micro laser welder (1064nm 150J)
w Viteris Technologies Precision Microwire EDM
w Omnicure 1000 UV curing (320-500nm)
w Dirty and cleanroom microfluidics processing
STAFF SERVICES
w Equipment Installation, Diagnostics, and Repair
o Alcatel ASM 180TD dry-pumped leak detector
w Professional Technical Support
o Design of Experiments (DOE)
o R&D Process Development
o Thin Film Deposition and Patterning
AFFILIATED MANUFACTURING LABS
w Mechanical Engineering Shops
o 3D printing / rapid prototyping
o Waterjet machining
o All traditional machine shop tools
w Interference Lithography photonics.ece.utah.edu
w Center for Biomedical Microfluidics www.mems.utah.edu
o PDMS and soft lithography
o CO2 laser micromachining
w Microsystems Laboratory www.microsystems.utah.edu
o (Bio)MEMS design and fabrication
o Advanced packaging
AFFILIATED CHARACTERIZATION LABS
w Co-located HSC Core Facility for Electron Microscopy
o www.cores.utah.edu/labs/EM/em.html
o JEM 1400 TEM (120 keV)
o FEI Technai T-12 TEM (120 keV), T-20 (200 keV cryo)
w Dixon Laser Institute www.physics.utah.edu/laser/
o Witec Alpha 300 SNOM, Raman, and Confocal
o FEI NovaNano 630 FE-SEM w/ EDS, CL and Nabity EBL
w Micro X-ray CT Lab –
o XRADIA Micro XCT-200
o Biorad FTS 6000 FT-IR
w Nanomaterials Characterization http://nanomaterials.utah.edu
o Hitachi S-4800 HR-SEM / Oxford EDS
o Micromeritics ASAP 2020 Surface Area (BET) Porosity
o Shimadzu GCMS-QP2010 Ultra GCMS
o Shimadzu UFLC HPLC
o Shimadzu UV-3600 UV-Vis-NIR Spectrophotometer
w AMANDA Lab www.ece.utah.edu/research/amanda
o Asylum Cypher AFM for nanolithography
w BYU: www.chem.byu.edu/faculty/matthew-r-linford/
o ION-TOF TOF-SIMS IV
w Materials Science http://characterizationlab.mse.utah.edu
o Philips X’Pert XRD
o Hitachi S3000-N SEM w/ EDS & EBSD
w XRD Lab ()
o XRD with high temp, 3-axis goniometer
o Laue camera
w Geology department
o QEMScan 4300 ()
o WDS microprobe (http://probelab.utah.edu)
o ICP-MS ()
w Energy and Geosciences Institute (http://egi.utah.edu)
o QEMScan 4300
o JEOL SEM with Oxford EDS and CL
o XRD/XRF mineral quantitation
o Wet laboratories
MRSEC AFFILIATED LABS
w Organic spintronics deposition system
w Sagnac Interferometer
w Magnetic Resonance X-band cw-EPR, ENDOR, ELDOR
w (3+3)-Pass Tandem Fabry-Perot Interferometer
w THz Time-Domain Spectrometer
w UV Time-Resolved Spectroscopy
April, 2014 For updates see www.nanofab.utah.edu
UTAH NANOFAB | College of Engineering | 36 S. Wasatch Dr. | Salt Lake City, UT 84112 | (801) 581-5676