Presentation Luncheon Friday, April 24th 11:30 to 1:00

SMTA Members, Non-members, Students, and Guests are welcome

RSVP requested

Title: State of the Art Electronics Assembly:

A Look at Material Advancements, Novel Process Development, and Dealing with Defects

Speaker: Denis Barbini Ph.D.

International speaker from Universal Instruments

Abstract:

The trend in packaging technologies that enables faster, more effective data transfer, and processing is a continuous goal for the entire supply chain. We look to understand how this continuous decrease in the size of components brings new reliability challenges as the microstructure of lead-free solder alloys is significantly affected by solder volume. It is well known that the microstructure of solder joints greatly affects the reliability of electronic packages. The impact of those various surface finishes on the microstructure of SAC305 lead-free LGAs, BGAs and CSPs, were investigated. A clear correlation between PCB surface finish, microstructure and reliability behavior was observed. The results assist in optimizing the design of packages and selection of materials that can lead to higher reliability performance of products. While component footprint size continues to decrease year after year, power dissipation continues to increase. Thermal interface materials (TIMs) are frequently used to increase the efficiency of heat transfer from the die to the thermal solution. In an effort to provide more realistic thermal resistance measurements, a variable load component level test fixture was developed for measuring the thermal resistance of TIMs. The microstructure of each gap pad was also studied in conjunction with thermal resistance measurements to help explain TIM performance. Another aspect for the advancement of packaging technology is the ever growing defect know as component warpage. This is the root cause for many manufacturing defects encountered by CMs who develop processes for the assembly of advanced products. While standards exist to address tolerable warpage, there are many devices that easily comply with the standards, as characterized utilizing the prescribed techniques, yet still produce HiP failures.
This talk looks to answer the questions: Can we assemble tomorrow's technology with current tools? Are we at a crossroad of accuracy for given material manufacturing techniques and assembly tools? What novel materials are required? Is there a convergence of semiconductor design and assembly with board assembly.Can we design quality into our device by optimizing materials and processes?
We answer these questions by looking at various case studies and the root cause of specific failures.

BIO

Denis C. Barbini, Ph.D.is the Associate Director of the Universal Instruments’ Advanced Process Laboratory. He started his career in the electronics manufacturing world after earning his Doctorate in Chemistry from Binghamton University. His current focus is identifying the critical needs in emerging technologies and electronics assembly processes in order to develop specific research and development projects. Denis has authored hundreds of peer reviewed articles, contributed to several books and presented to thousands of his peers on the results of his research over the past 17 years.
Denis has travelled the electronics manufacturing world visiting over 30 countries providing solutions to people and companies designing and manufacturing devices such as cell phones and computers to pacemakers and aerospace devices. These companies look to implement cost effective, reliable and robust processes in place that deliver the specified functionality and reliability.

Location: Doubletree Hotel

4099 Valley View Lane in Dallas (Near the intersection of I-635 @ Midway RD, 1 block NW). Lower level, watch for the SMTA signs to Palm Court

11:15am(doors open) Lunch buffetwith multiple entrees, salad and dessert.

To attend, we ask that you RSVP reply by COBApril 22 to this e-mail so we can have proper table space set up. Do it now so you don’t forget.

Agenda

11:00-11:30check-in

11:30 Lunch begins

11:45 Chapter Announcements

12:00 Presentation begins

1:00 Adjourn from meeting

Pricing:

FREE to SMTA Corporate Member Sponsors

$15 cash for:

Members(Individual, Participating, Associate, & Student)

Employees of corporate members

$ 20 cash for:

Guests/visitors/ non-members

For lots more information click onNEWSLETTER

SMTA Dallas Volunteers arrive 30 minutes before event:

  • Greeters (Cindy Herdon, Jack Harris)
  • Name Tags (Carol Primdahl)
  • Room set-up (Jimmy Fallin, Peter Lee)
  • Treasurer (Jim Baker)
  • Secretary (Keith Larson)
  • VP (Jack Harris)
  • VP Technical (Viswam Puligandla)
  • VP Membership (Riki Brown)
  • Newsletter (Karl Doebbert)
  • Web site (Alicia Hamby)
  • Technical Committee (Darrell Ray, Tiao Zhou)
  • President (Gary Tanel)

These events are sponsored by your SMTA Dallas Chapter