Ronald LinSept. 11, 1999

EECS 245: MEMS Assignment #1

Professor Pister

University of California, Berkeley

MEMS Journals (P1.1-P2)

Journal 1 / Journal 2 / Journal 3
Information / IEEE Journal of Microelectromechanical Systems / Sensors and Actuators A / Microsystem Technologies
1. Call Number / TK153 J6 / TJ 223 T7 S44 / TK 7874 M4886
2. Recent Issues / In the back left corner of the library where the IEEE, semiconductor and materials research journals are shelved. / In the back left corner of the library where the IEEE, semiconductor and materials research journals are shelved. / In the back left corner of the library where the IEEE, semiconductor and materials research journals are shelved.
3. Bound Issues / Upstairs 8th aisle from front of library / Upstairs 5th aisle from front of library / Upstairs 15th aisle from front of library
4. Editors / Richard Muller, Ed. In Chief / S. Middelhoek, Ed. In Chief, J. Van der Spiegel (US) / H. Reichl
5. Berkeley Faculty on Board. / R. T. Howe, A. Pisano (Emeritus Ed.) / None / A. Pisano, R. T. Howe

P3.

MEMS Researcher / Education / Current Employment
Nicolaas F. de Rooij / MS. State University of Utrecht, PhD. Twente University (1978) / Professor at Federal Institute of Technology, Switzerland
M. A. Schmidt / BS. EECE RPI, MS/PhD. EECS MIT (1983,8) / Prof. of EE at MIT since 1988, Director of Microsystem Tech. Lab
M. Elwenspoek / MS/PhD. Freie Universitat, Berlin, Germany / Head of Micromechanics Dept. at U. of Twente
R. T. Howe / BS Harvey Mudd, MS/PhD UC Berkeley (1981,4) / Professor, UCB
Director of BSAC

P4.

JAMES M. BUSTILLO, ROGER T. HOWE, AND RICHARD S. MULLER. Surface Micromachining for Microelectromechanical Systems. PROCEEDINGS OF THE IEEE, VOL. 86, NO. 8, p1552 AUGUST 1998

Polysilicon is widely used as a structural material in MEMS because its robust morphology (strain, strain gradient, modulus, Q, etc.) can be well controlled through processing conditions, and because its past history as a major component in MOS technology is a convenient source of reference and understanding. The need, however, for materials properties uncharacteristic of polysilicon, such as higher reflectivity, less stiction, and lower thermal budget processing, has resulted in alternative materials research of various metals, spin on organics and polymers, often in parallel with MOS research of new low k/high k dielectrics and low resistivity metals. As MEMS technology emerges in industrial and consumer devices, this materials and processing fundamental research will extend to packaging concerns, including sealing and encapsulation.

P5.

Favorite Paper:

Yogesh B. Gianchandani, Member, IEEE, Meenam Shinn, and Khalil Najafi. Impact of High-Thermal Budget Anneals on Polysilicon as a Micromechanical Material. JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, VOL. 7, NO. 1, MARCH 1998

This paper is interesting as it quantifies stress in polysilicon and oxide films, analyzing stress with respect to typical MOS thermal budgets and MEMS thermal budgets for both doped and undoped poly Si.

P6.

I like the carrels on the second floor of the engineering library because they are close to the bound IEEE journals and TK7871, where many semiconductor references are located.