Time Delay Integration (TDI) Charge Coupled Device (CCD) requirements

Table 1:Electro-optical requirements of sensor:

Unless and otherwise specified all parameters to be measured at 25°C

Sr.No. / Parameter Description / Requirements
1 / Number of TDI arrays in one package / 3
2 / Array to array (centre to centre) separation / ≥2002um
3 / Element size / 13μmx13μm
4 / Photosensitive elements (32 lines of 5200 elements) / 5200 x 32
5 / Externally selectable stage options / 1, 4, 8, 16, 32
6 / Spectral response / 450nm - 950nm
7 / Pixel readout rate per output port / ≥10MHz
8 / Number of outputs per array / 4
9 / Array to array and port to port coupling/crosstalk / to be measured on one device
and provide information
10 / Conversion Factor / ≥5μV/e-
11 / Saturation charge / ≥200ke-
12 / Average Responsivity / to be provided by manufacturer at three different wavelengths 450nm, 650nm, 850nm
13 / Read Noise / ≤60e-
14 / Average Dark current / ≤1.5nA/cm2
15 / Output Signal Non-Linearity (10% to 80% of saturation) / ≤2%
16 / Dark current density / to be provided by manufacturer
17 / RMS Photoresponse Non Uniformity in:
450-520nm
520-580nm
620-690nm
770-860nm
For 32 stage / ≤ 3% for all 4 bands
18 / Charge Transfer Inefficiency vertical / ≤2%
19 / Charge Transfer Inefficiency horizontal / ≤2%
20 / MTF in TDI direction TDI at Nyquist / ≥50% at 500 nm
≥37% at 700 nm
≥25% at 900 nm

Table 2: Geometrical Parameter

Parameter / Specified values/tolerance / Definition/description
ΔXi / ± 0.5 μm / The tolerance on the distance between first element and ith element of any one stage with respect to (Lox (i-1) / (N-1))
ΔYj / ± 0.5 μm / The tolerance on the distance between first element and jth element of any one pixel with respect to (Loy (j-1) / (Ns-1))
N / 5200 / The number of active pixels along X-axis.
Ns / Number of TDI stages (1, 4, 8, 16, 32) along Y-axis shall be selectable.
Pcx, Pcy / 13 μm X 13 μm / Pixel pitch in x and y direction
ΔZ / ≤± 25 μm / Deviation of zi,j co-ordinates from the best fit plane
Δtx, Δty / ≤ ± 100 μm / Die position tolerance in X, Y direction w.r.t package
ΦD (in X, Y direction) / ≤ ±0.4 degree / Die orientation w.r.t package

Table 3: Package and storage Requirements

Sr.No. / Parameter Description / Requirements
1 / Operating temperature / 0°C to +70°C
2 / Storage temperature (non-operating) / -55°C to +150°C
3 / Package (ceramic package hermitically sealed with glass window) / AlN PGA, 128 pins

R & QA

  1. The devices shall be processed and tested as follows:
  • In process inspection as per Table-1.
  • Screening on 100% basis as per Table-1.
  • QCI inspection: Group A, Group B & Mechanical Sub-Group testing as per Table-2.

Table-1: In process Inspection and Screening Test Plan

Operation / Sampling level / Applicable method
Wafer electrical test / 100% / Internal specification
Wafer sawing / 100% / Internal specification
Die visual inspection / 100% / MIL-STD 883 method 2010
Marking / 100% / Internal Inspection
Die attach / 100% / Internal specification
Die attach inspection / 100% / MIL-STD 883 method 2010
Die position inspection / sampling / Manufacturer’s specification
Die flatness test / sampling / Manufacturer’s specification
Wire bonding / 100% / Manufacturer’s specification
Bond strength test / Lot by lot (As per Table-2) / MIL-STD 883 method 2011
Die shear or stud pull test / Lot by lot (As per Table-2) / MIL-STD 883 method 2027
Wire bonding inspection / 100% / MIL-STD 883 method 2010
Window Inspection / sampling / Manufacturer’s specification
Encapsulation / 100% / Manufacturer’s specification
Sealing Inspection (Internal and External) / 100% / MIL-STD 883 method 2009 & 2010
High temperature stabilization bake / 100% / MIL-STD 883 method 1008, 48 H @ 150°C
Temperature cycling / 100% / MIL-STD 883 Method 1010 -55°C to +125°C, 10 cycles
Fine Leak Test / 100% / MIL-STD 883 Method 1014 Condition A
Gross Leak Test / 100% / Done by visual inspection of the glass lid glue filet
Electrical Measurement at reference temperature / 100% / Manufacturer’s Internal specification
Power burn-in / 100% / MIL-STD 883 Method 1015 240H @125°C
Electrical Measurement at reference temperature / 100% / Manufacturer’s Internal specification
PDA Calculation
Drift Criteria / Lot by lot
Mutually agreed upon / 5% or 1 part from pre to post burn-in test by assembly lot
Electro-optical Measurements / 100% / Device specification
External Visual Inspection / 100% / MIL-STD 883 method 2009
Packing / 100% / Manufacturer’s Specification
QCI Group A: Electrical Test / Sampling (As per Table-2) / Manufacturer’s Specification
QCI Group B / Sampling (As per Table-2) / Based on MIL-STD 883
Mechanical Sub-Group Testing / Sampling (As per Table-2) / Based on MIL-STD 883
Certificate of Compliance / Lot by lot (As per Table-2) / Internal Specification

Table-2: Qualification Test Plan

QCI Group A: Electrical Test / 10 (0) / Manufacturer’s Specification
QCI Group B / 2 (0) / MIL-STD 883 Method 5005
Resistance to Solvent
Solderability
LAT2 / 6 (0)
Initial E-O measurement
Operating Life Test
External Visual Inspection
Final E-O measurement
Mechanical Sub-Group / 2 (0)
Initial E-O measurements / Manufacturer’s Specification
Visual Inspection / MIL-STD 883 method 2009
Mechanical Shock Test / MIL-STD 883 Method 2002, Condition-B
Vibration Variable Frequency / MIL-STD 883 Method 2007, Condition-A
Visual Inspection / MIL-STD 883 method 2009
Final E-O measurements / Manufacturer’s Specification
Fine Seal Leak Test / MIL-STD 883 Method 1014 Condition A
Geometrical Measurements / Manufacturer’s Specification
Bond strength test / MIL-STD 883 method 2011
Die shear or stud pull test / MIL-STD 883 method2027
Certificate of Compliance / Lot by lot / Internal Specification
  1. The deliverable devices shall be accompanied with the following documentation:
  1. Certificate of compliance
  2. Complete data package including test reports as indicated below.

a)In process inspection: die attach, wire bond, window inspection for optical acceptance, sealing inspection.

b)100% read and record data of screening

c)Group A & B and Mechanical Sub-Group test report including detailed read & record data

The above data requirements also apply in case the devices offered are an overrun from other space programs. However, as a minimum the data pack shall include complete test details and attributes data for the delivered devices.

  1. Packaging, Storage & Transportation:
  1. Each unit shall be packaged in order to protect the device against ESD, electrical, mechanical and environmental damage.
  2. Further, the individual packages and the intermediate packages shall be fixed within the shipping package, which shall be resistant to mechanical shocks, humidity and dust.
  3. Wherever required, the individual packages for the units and/ or transportation container shall have facility for nitrogen purging, so that the unit is purged with dry nitrogen before shipment, to prevent contamination and corrosion.
  4. It is to be noted that "Pink poly-foam" shall not be used for packing of the individual units, as it has a corrosive effect on gold plating of the device body and leads.
  5. The shipping documentation shall be enclosed in the shipping package.

In addition to other mandatory shipping markings, the following additional marking shall appear on the shipping package in bold letters:

“HANDLE WITH CARE”

“ESD SENSITIVE”

“HIGH-RELIABILITY COMPONENTS"

“TO BE OPENED UNDER CLEAN ENVIRONMENT WITH ESD

PROTECTION ONLY IN PRESENCE OF ISRO AUTHORIZED

PERSONNEL”

“STORE IN A COOL AND DRY PLACE”

Table-3

Deliverables and Delivery schedule

S. No. / Item / Qty. / Schedule
1 / Interface control document / 1 / T0+3 months or earlier
2 / Generic radiation test results / 1 / T0+6 months or earlier
3 / FM detector / 2010 / T0+15 months
4 / FM Test report / 1 / T0+15 months
5 / Data package report / 1 / T0+15 months
6 / LAT devices / 1 lot / T0+15 months
7 / Lot acceptance test report / 1 / T0+15 months

T0: Date of signing of contract or receipt of export license whichever is later