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ENVIRONMENTAL STRESS SCREENING
TABLE OF CONTENTS
CHAPTER 1– INTRODUCTION.…………………………………...... 1
1.1– WHY ESS?………………………………………………………...... 1
1.2– HOW ESS WORKS?…………………………………………...... 3
1.3– WHAT THIS BOOK OFFERS?…………………………………...... 6
CHAPTER 2– HISTORICAL PERSPECTIVE OF ESS.……………...... 15
CHAPTER 3– ESS DEFINITIONS, BASIC CONCEPTS AND
COMMON MISCONCEPTIONS……………………...... 21
3.1– WHAT IS ESS?……………………………………………...... ……21
3.2– DEFINITIONS AND ACRONYMS OF FREQUENTLY
USED TERMS IN ESS…………………………………...... ………..22
3.3– COMMON MISCONCEPTIONS ABOUT ESS………...... …………53
CHAPTER 4– ESS TYPES AND THEIR
EFFECTIVENESS………………………...... ……………...61
4.1– FLAW-STIMULUS RELATIONSHIPS…………...... …………….61
4.2– ESS TYPES…………………………………………...... ……………66
4.3– SCREEN PARAMETERS…………………………...... …………..73
4.4– POPULARITY AND EFFECTIVENESS OF
ESS TYPES………………………………………...... ………………75
4.5– ADVANTAGES OF TEMPERATURE CYCLING…...... …………..78
CHAPTER 5– ESS STANDARDS AND DOCUMENTS FOR
ELECTRONIC ASSEMBLIES……...... …………………...81
5.1– BACKGROUND……………………………………...... ……………81
5.2– AN UPDATED OVERVIEW………………………...... ……………82
CHAPTER 6– THE STATISTICAL QUANTIFICATION
AND OPTIMIZATION OF ESS…………...... ……………..93
6.1– INTRODUCTION……………………………………...... …………..93
6.2– ASSUMPTIONS……………………………………...... ……………94
6.3– PART LEVEL SCREENING………………………...... …………….95
6.4– SYSTEM LEVEL SCREENING………………………...... ……….107
6.5– TWO-LEVEL SCREENING: THE LIFE-CYCLE
COST MODEL………………………………………...... …………118
6.6– BAYESIAN APPROACH TO ESS…...... …………………………..134
6.7– COMMENTS…………………………...... ………………………...148
CHAPTER 7– PHYSICAL QUANTIFICATION OF ESS BY
THERMAL CYCLING……...... …………………………..167
7.1– THE ARRHENIUS MODEL AND ITS PITFALLS……...... ……...167
7.2– MODIFICATION AND PARAMETER ESTIMATION
OF THE ACCELERATION FACTOR EQUATION…...... ………..172
7.3– TEMPERATURE PROFILE AND THE MODEL
FOR THE ACCELERATION FACTOR……………...... ………….176
7.4– EQUIVALENT ACCELERATION FACTOR EVALUATION
USING EQ. (7.26)…………………………………...... ……………180
7.5– EQUIVALENT ACCELERATION FACTOR
EVALUATION USING EQ. (7.27)………………...... …………….184
7.6– APPLICATION OF THE AGING ACCELERATION
MODELS……………………………………………...... ………….189
7.7– OPTIMUM NUMBER OF THERMAL CYCLES FOR A
SPECIFIED FIELD MTBF GOAL……………………...... …………..193
7.8– A SUMMARY OF SOME USEFUL THERMAL
FATIGUE LIFE PREDICTION MODELS FOR
ELECTRONIC EQUIPMENT……………………...... …………….197
7.9– CONCLUSIONS……………………………………...... …………..205
CHAPTER 8– PHYSICAL QUANTIFICATION AND
OPTIMIZATION OF ESS BY RANDOM
VIBRATION…………...... ………………………………..215
8.1– INTRODUCTION……………...... …………………………………215
8.2– FUNDAMENTAL THEORY OF A RANDOM
PROCESS…………………...... …………………………………….216
8.3– FAILURE DUE TO RANDOM VIBRATION AND
STRUCTURAL RELIABILITY EVALUATION……...... ………...246
8.4– OBTAIN THE STRESS RESPONSE PSD FUNCTION
FROM FINITE ELEMENT ANALYSIS………………...... ………291
CHAPTER 9– ESS BY COMBINED ENVIRONMENTS
THERMAL CYCLING AND RANDOM
VIBRATION………………...... ………………………….295
9.1– INTRODUCTION………………………...... ………………………295
9.2– THE THERMAL FATIGUE LIFE MODEL……...... ……………...297
9.3– THE RANDOM VIBRATION FATIGUE LIFE
MODEL………………………………………...... …………………298
9.4– COMBINED RELIABILITY ANALYSIS……...... ………………..299
9.5– OPTIMUM SCREENING STRATEGY………...... ………………..302
CHAPTER 10– ESS BY APPLYING MULTIPLE
STRESSES……………………...... ……………………..311
10.1– AGING ACCELERATION UNDER MULTIPLE
STRESSES-A TEST ON THE EFFECT DEPENDENCY
OF COMBINED STRESSES…………...... ……………………….311
10.2– AN ECONOMIC MODEL FOR OPTIMUM STRESS
REGIMEN DETERMINATION FOR A
MULTIPLE-STRESS ASSEMBLY-LEVEL
STRESS SCREEN.……………………...... ……………………….316
10.3– COMMENTS…………………………...... ……………………….323
CHAPTER 11– SCREENING STRENGTH AND THE RELATED
EMPIRICAL EQUATIONS IN ESS……...... …………...325
11.1– DEFINITION OF SCREENING STRENGTH………...... ………..325
11.2– SCREENING STRENGTH UNDER DIFFERENT
SCREENING STRESSES…………………………...... …………..325
11.3– AVERAGE DEFECT FAILURE RATE ESTIMATION
UNDER DIFFERENT SCREENING STRESSES…...... ………….330
11.4– MODEL APPLICABILITY…………………………...... ………...337
CHAPTER 12– ESS PLANNING…………………………...... …………..369
12.1– INTRODUCTION……………………………………...... ………..369
12.2– ESTABLISHMENT OF THE REMAINING DEFECT
DENSITY OBJECTIVES……………………………...... ………...370
12.3– INCOMING DEFECT DENSITY ESTIMATION…...... …………374
12.4– SCREENING PARAMETER SELECTION…………...... ………..387
12.5– SCREENING STRENGTH…………………………...... …………398
12.6– TEST DETECTION EFFICIENCY…………………...... ………...401
12.7– TEST STRENGTH………………………………...... …………….401
12.8– PROCEDURE FOR QUANTIFICATION
SELECTION……………………………………...... ……………...403
12.9– ECONOMIC OPTIMIZATION OF ESS PLANNING…...... ……..404
CHAPTER 13– TAILORING TECHNIQUE IN ESS………...... …………407
13.1– THE MECHANICS OF TAILORING…………………...... ……...407
13.2– STRESS RESPONSE SURVEY………………………...... ………408
13.3– TAILORING OF ENVIRONMENTAL STRESSES…...... ……….409
CHAPTER 14– MONITORING, CONTROL AND
EVALUATION OF ESS………………………………………………415
14.1– INTRODUCTION………………………………………...... …….415
14.2– DATA COLLECTION AND FAILURE
CLASSIFICATION………...... ……………………………………415
14.3– MONITORING AND CONTROL IN THE SCREENING
PROCESS…………………...... …………………………………...417
14.4– EVALUATION FOR THE SCREENING PROCESS……...... …...422
CHAPTER 15– AN APPLICATION OF DOD-HDBK-344 IN
DEVELOPING A CLOSED-LOOP DYNAMIC
ESS PROGRAM…...... …………………………………...425
15.1– INTRODUCTION……………...... ………………………………..425
15.2– PRODUCT DESCRIPTION………...... …………………………..425
15.3– CLOSED-LOOP ESS PROCESS.…...... ………………………….426
15.4– INCOMING DEFECT PREDICTION…...... ……………………..426
15.5– SCREENING SELECTION AND PLACEMENT…...... …………428
15.6– DATA COLLECTION……………………………...... …………...432
15.7– DATA ANALYSIS AND PROCESS MONITORING…...... …….435
15.8– FAILURE CAUSE INVESTIGATION AND
CORRECTIVE ACTIONS……………………………...... ……….437
15.9– CONCLUSIONS……………………………………...... …………438
CHAPTER 16– ESS CASE HISTORIES……………...... ………………...439
16.1– ESS IN THE APOLLO SPACE PROGRAM…...... ……………….439
16.2– ESS ON NEW PRINTERS IN IBM……………...... ……………...439
16.3– ESS ON SWITCHING LOGIC UNITS AT
LOCKHEED…………………………………...... ………………...441
16.4– AMERICAN AIRLINES ESS DEMONSTRATION……...... …….441
16.5– POWER SUPPLY RANDOM VIBRATION STRESS
SCREENING AT ZYTEC………………………………...... ……..441
16.6– THERMAL CYCLING SCREENING OF A
SPACECRAFT AT HUGHES…………………………...... ………446
16.7– ESS ON SHIPBOARD MILITARIZED DIGITAL
COMPUTER…………………………………………...... ………...447
16.8– RANDOM VIBRATION OF AN AIRBORNE DIGITAL
COMPUTER……………………………………………...... ……...447
16.9– RANDOM VIBRATION SCREEN OF AN ADVANCED
SIGNAL PROCESSOR…………………………………...... ……..448
16.10– THERMAL CYCLING SCREENING ON AIRBORNE
RADAR MODULE……………………………………...... ……..450
16.11– STRIFE TEST PROGRAM IN
HEWLETT-PACKARD……………………………...... ………...451
16.12– STRIFE TESTING AT ZYTEC HELPS THE
COMPANY WIN BALDRIGE………………………...... ………454
16.13– COST EFFECTIVENESS OF ESS DEMONSTRATED
AT ROBINS AIR FORCE BASE……………………...... ………458
16.14– RANDOM VIBRATION SCREENING OF
MILITARIZED AVIONIC COMPUTERS AT IBM…...... ……..459
16.15– ESS OF A HIGH-DENSITY SURFACE MOUNT
CIRCUIT CARD AT AT&T LITTLE ROCK…………...... …….462
16.16 – AUTOMATED ESS OPTIMIZATION FOR U.S.
ARMY ELECTRONIC HARDWARE………………...... ………467
16.17– ESS AS APPLIED TO A NEW COMPUTER…………...... …….474
INDEX…………………………………………………………...... ……....493
ABOUT THE AUTHORS……………………………………...... ………..514