Agenda for 7-24 Process Effects Conference Call

IPC 9121 Troubleshooting for Printed Board Fabrication Process

March 12, 2012, 3 PM Eastern

1.  Welcome – Denny Fritz, Marc Carter

2.  Review of IPC Apex Meeting,

3.  Discussion of KAVI input tool – is everybody registered on KAVI

4.  Status Update with Information for Review – we have inputs in all 16 chapters.

9121 Topic Descriptions / Old 740 / A-600 / JPCA Guide / Interested
Comments
1.0 / General information / Section 1. General Introduction / Fritz
Carter – Inputs made.
Rest of 1 depends other work.
terminology and specifications
2.0 / Documentation / Section 2 Design and Documentation / Bergman working on 2 = 50% done, a good model.
Ferrari?
fabrication drawing, board BoM, schematic / Brad Toone has pictures of problems in this area
3.0 / Tooling and fixturing / Section 3 Phototooling / Dietz comments made
Carter forward to Jeff Danzer for LDI inputs.
phototooling, imaging
4.0 / Base material / Section 4 Laminate / 2.2 Base Material / Need Isola, Nelco
Carano input made
recruit
Goldman.
rigid, flex, HDI, metal, ceramic / 2.3 Base Material Subsurface
4.1 Flex and Rigid Flex Circuitry
5.0 / Mechanical operations / Section 5 Drilling / Machining Defects / Crano review need people.
Carano input made
scoring, routing, tool holes, slotting / 2.1 Board Edge / Kevin Stumpe, Rockwell. Carter forwarded Carano to Stumpe
Goldman input
6.0 / Handling / Ventress.
Fritz started on an outline.
Terry Munson interested in layer fab.
Carter will only ask Dale Murry about help Refernece the IPC Storage/Handling document, Goldman input from section 1
7.0 / Hole preparation and protection / Section 6 Hole Preparation / PTH Defects / Carano
Watkowsk
i Carano input made. Brad Toone from L-3 pictures copper cap separation.
Defect – plug material.
drilling, plating, filling / Section 7 Hole conductivity creation / 2.6.Unsupported Holes
3.3 Plated Through Holes General / Goldman inputs
3.4 Plated Through Holes - Drilled
8.0 / Conductors and surface protection / Section 9 Primary Image formation / 2.4. Solder Coatings / Conductor Defects / Carano, Ball,
electro-deposited, wrought, printed, formed / Section 10 Electroplate / 2.5 Plated Through Holes
Section 12 Inner Layer / 2.10 Pattern Definition - Dimensions / Final Finish here. – work with
Section 14 Part
Metallic surface finishes / 3.2 Conductive Patterns
9.0 / Layering and lamination / Section 13 Multilayer fab / 3.1 Dielectric Materials / Carter trying for Collins SME
pre-lam, sequential, and build-up multilayer / 4.2 Metal Core Boards / Press vendor.
Contact Mike Hill?
10.0 / Embedded device characteristics / (New) / Solberg coments made
Send Dieter copy. Needs format, but a start.
discrete insertion, IC insertion, formed components / Brad Toone has pictures of 3M c-ply.
New Document – Vern. Solberg
11.0 / Process specifics / Section 11 Etching / Solberg, Dietz,
electroplating, etching / Some – Section 10 Electroplate / Dietz wants in Word.
12.0 / Coating and legend / Section 14 Part Organic protection / 2.9. Solder Mask / Solder Resist Defects / Vaughn – New address
Pauls?
Goldman inputs
solder mask, liquid cover coat, legend ink / Section 15 Permanent organic coats / 2.8. Marking / Symbol Mark Defects / Goldman inputs
Brad Toone has pix of legend ink in holes, Solder mask registration
13.0 / Cleaning / Section 8 Cleaning / 5.0. Cleanliness Testing / Dietz Comments Made
Dieter worked on this at meeting.
manual and automated; in-process and final
14.0 / Inspection / (New) / 5.1. Solderablity Testing / Bergman,
visual, magnification, measurement, go/no-go
15.0 / Testing / (New) / 5.2. Electrical Integrity / Snogren?
electrical continuity, end-use, x-ray
16.0 / Reliability stress conditioning / (New) / Insufficient Board Reliability / Fritz started
stress conditioning
Blue color denotes available in Word

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5.  Sources of board fab defect information for 9121

·  NPL defect database from GB

·  Process effects roundtables – other IPC Documents

·  Tie to A-600

6.  Plan of future meetings –

·  Conference calls – Second Monday at 3:00 Eastern - Next – March 12, April 9

·  Face to face at IPC – before summer? Suggest sub-team meetings for certain groups.

·  Next full meeting – IPC fall meeting – end of August.

·  Suggest a target date for chapter reviews