CSEM/ MEMSORS / EURIMUS Project number: EM89
MEMSORS
Micromachined Electrostatic Membranes for acoustic SENSors
Piezoelectrics have been for long time the preferred materials for ultrasound imaging transducers.However, the rapid development of new diagnostic modalities and the requirements for high density functionality make the design of piezoelectric transducers more and more complex to fit new specifications and manufacturing not compatible with reliable processes and cost efficiency.
With respect to the market analysis and customer feedback, the MEMSORS consortium has taken the unique opportunity to develop novel generation of unprecedented ultrasound product based on Capacitive Micromachined Ultrasonic Transducers (CMUTs) capable of outperforming conventional technology at very competitive and large volume capable processes.
The project wasstructured as a smart embedding of well controlled sub component technologies in innovative product. The work to be performedincluded implementation of micro machined electrostatic membranes, specific interconnect, analog signal circuits and transducer packaging / assembly through the following actions:
- Novel design and fabrication process of silicon imaging ultrasound arrays.
- Specific CMUT configuration topology and designs for high frequency and compact ultrasonic transducer.
- Optimized fabrication yield and reproducibility in CMUT manufacturing.
- Development of custom high density interconnection means, including through wafer interconnection.
- Analog circuits for use in CMUT probes.
- Optimization of the application-oriented packaging and miniaturization of products.
This project throughultrasound imaging arrays provided the CMUT components supporting new industrial opportunities to explore other domains of application such as microfluidics, physical and chemical sensors, biometric systems...
The MEMSORS Consortium combinedoutstanding Industries and Research teams internationally recognized in microsystems, microelectronics, MEMS, medical diagnosis solutions and packaging (VERMON SA, microFAB GmbH, Hybrid SA, ST microelectronics SA, CSEM and Tours University).
As a multi-disciplinary project, MEMSORS will actively contribute to market and technology diversification, a sine qua non condition for European competitiveness. The industrial co-operation between top of the art companies in sharing knowledge and in achieving unified objectives is a driving factor of economic development.
Name of the European projects: MEMSORS Micromachined Electrostatic Membranes for acoustic senSORS
MEMSORS in numbers:
36months 1.03.2005-28.02.2008
4.5mio EURO
Field: ultrasound imaging transducers
Type of project:
This work was performed through the research project MEMSORS EM89 labelled by the EUREKA's cluster program EURIMUS and funded by the French Ministry of Finances / Direction Générale des Entreprises (DGE) and the German Bundesministerium für Bildung und Forschung (BMBF).
Goal of the projects: Replace piezoelectric technology by Capacitive Micromachined Ultrasonic Transducers (CMUTs) capable of outperforming conventional technology at very competitive and large volume capable processes.
Impact delivered:
Cheaper and more efficient transducers for echographic devices for medical diagnostic.
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Economic or social benefit?
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Partners:
Vermon SAFrance Coordinator
microFAB Bremen GmbHGermany
Hybrid SA Switzerland
CSEM Switzerland
ST Microelectronics SAFrance
Université de Tours (LMP-LUSSI)France
Website:
Why CSEM in this project?
CSEM was involved in the project because of its competence in microelectronics, microsystems and low-power electronics. CSEM was responsible for the miniaturized low-noise low-power analog electronics making CMUT compatiblewith standard electronics used in ultrasound imaging systems, and for the integration and interconnection of ICs and analog signal components.
Coordinator :
Vermon SAFrance
List of Partners:
microFAB Bremen GmbHGermany
Hybrid SA Switzerland
CSEM Switzerland
ST Microelectronics SAFrance
Université de Tours (LMP-LUSSI)France
Contact Information:
Rémi Dufait (Deputy CEO) :
VERMON SA
180, rue du Général Renault BP 93813
37038 Tours cedex
VERMON
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