Standard for Printed-Wiring Boards

Scope Table of Contents

1.1 These requirements apply to rigid printed-wiring boards and flexible printed-wiring board for use as components in devices or appliances. Compliance with these requirements does not indicate that the product is acceptable for use as a component of an end product without further investigation.

1.2 The flexible printed-wiring boards covered by these requirements consist of conductors affixed to insulating base film, with or without a cover-lay film, with midboard connections.

1.3 These requirements do not cover flexible printed-wiring boards of laminated-film construction in which the conductors are parallel to each other and are completely covered by the base film with only point-to-point end connections.

1.4 These requirements do not apply to flexible, flex-to-install, rigid, and multilayer rigid flex composite interconnect constructions with and without stiffener and adhesive materials as flexible materials interconnect constructions (FMIC's) for use as components in devices or appliances - that are covered by the Standard for Flexible Materials Interconnect Constructions, UL 796F.

  • Cover
  • Transmittal
  • Table of Contents
  • Body
  • INTRODUCTION
  • 1 Scope
  • 2 Glossary
  • 3 Units of Measurement
  • 4 Measurement Accuracy and Testing Conditions
  • 5 Supplementary Test Procedures
  • 6 References
  • 7 General
  • CONSTRUCTION
  • 8 General
  • 9 Base Materials
  • 9.1 General
  • 9.2 Metal-clad base material
  • 9.3 Direct support
  • 10 Conductors
  • 10.1 Materials
  • 10.2 Silver
  • 10.3 Conductive coating
  • 10.4 Edges and width
  • 10.5 Pattern surfaces
  • 10.6 External copper foil or cladding process weight
  • 10.7 Midboard conductor
  • 10.8 Edge conductor
  • 10.9 Contact surface plating
  • 10.10 Plated-through holes
  • 10.11 Additional conductive plating
  • 10.12 Solder limits
  • 10.13 Pattern
  • 11 Adhesives for Conductor Bonding
  • 12 Processes
  • 12.1 General
  • 12.2 Multiple-site processing
  • 13 Permanent Coatings
  • 13.1 General
  • 13.2 Permanent coatings program
  • 14 Plugged-Hole Materials
  • 15 Embedded Components
  • 16 Singlelayer (Singlesided and doublesided) Printed-Wiring Boards
  • 16.1 General
  • 16.2 Metal-clad (MCIL/CCIL)
  • 17 Multilayer Printed-Wiring Boards
  • 17.1 General
  • 17.2 Assembly
  • 17.3 Mass laminate printed wiring boards
  • 17.4 Electrical insulation
  • 17.5 Laminations
  • 17.6 Dissimilar dielectric materials evaluation
  • 17.7 Interlayer connections
  • 17.8 Metal-clad laminate and prepreg materials
  • 18 Metal Base Printed-Wiring Boards
  • 18.1 General
  • 18.2 Vertical flammability evaluation for metal base PWBs
  • 18.3 Bond strength evaluation for metal base PWBs
  • 19 Flexible Printed-Wiring Boards
  • 20 Variations In Printed-Wiring Board Construction
  • PERFORMANCE
  • Sub-Section
  • 21 Test Samples
  • 22 Data Collection
  • 23 Microsection Analysis
  • 23.1 General
  • 23.2 Test samples
  • 23.3 Etching the sample surface
  • 23.4 Material and test pattern parameter examination
  • 24 Thermal Shock
  • 25 Flammability
  • 25.1 General
  • 25.2 Samples
  • 25.3 Conditioning
  • 26 Bond Strength
  • 26.1 After thermal shock
  • 26.2 As received
  • 26.3 Oven conditioning
  • 27 Delamination and Blistering
  • 28 Dissimilar Dielectric Materials Thermal Cycling Test
  • 28.1 General
  • 28.2 Thermal cycling
  • 29 Plating Adhesion
  • 30 Conductive Paste Adhesion Test
  • 31 Dielectric Materials Intended for Use in Fabricating High Density Interconnect (HDI) Type Constructions
  • 31.1 General
  • 31.2 HDI Vertical flammability evaluation
  • 31.3 HDI Bond strength, delamination and blistering evaluation
  • 31.4 HDI Thermal cycling
  • 31.5 Test programs for HDI PWB construction variations
  • 32 Silver Migration Test
  • 32.1 General
  • 32.2 Procedure
  • 32.3 Results
  • MARKINGS
  • 33 General
  • FOLLOW-UP INSPECTION
  • Superseded List

Details

Edition Number:

10

Edition Date:

10/08/2010

Price Code:

C

Type:

ulstd

ANSI Approved:

01/18/2012

DOD Approved:

01/20/1995

2-796F

1.1.1 These requirements apply to flexible material printed wiring board constructions (FMIC?s) for use as components in flexible, flex-to-install, rigid, and multilayer rigid-flex composite applications with and without stiffener and adhesive materials in devices or appliances.

1.1.2 Together with the Standards mentioned in the Supplementary Test Procedures, Section 1.3, these requirements provide data with respect to the physical, electrical, flammability, thermal, and other properties of the FMIC under consideration and are intended to provide guidance to the fabricator, end product manufacturer, safety engineers and other interested parties.

1.1.3 Compliance with these requirements does not indicate the product is acceptable for use as a component of an end product without further investigation.

1.1.4 The singlelayer and multilayer flexible, flex-to-install, and multilayer rigid-flex composite constructions addressed by these requirements consist of conductors affixed to base material, with mid-board interconnections, and cover materials.

1.1.5 The suitability of additional stiffener and adhesive materials, not evaluated in accordance with Stiffener and adhesive materials, Section 2.9, the Stiffener bond strength test, Section 5.11, and Flammability tests, Section 5.13, are subject to the applicable end-use product construction and performance requirements. See Additional stiffener and adhesive (external bonding) materials, Section 7.12, for marking requirements for FMIC?s provided with additional stiffener and adhesive materials not investigated.

1.1.6 The requirements for rigid printed wiring boards are in the Standard for Printed Wiring Boards, UL 796.

  • Cover
  • Transmittal
  • Table of Contents
  • Body
  • 1 Introduction
  • 1.1 Scope
  • 1.2 Units of measurement
  • 1.3 Supplementary test procedures
  • 1.4 References
  • 1.5 General
  • 1.6 Glossary
  • 1.7 Abbreviations
  • 2 Materials
  • 2.1 General
  • 2.2 Base materials
  • 2.3 Conductors and conductor adhesives
  • 2.4 Bonding film (supported and unsupported) and internal bonding materials
  • 2.5 Cover material
  • 2.6 Solder resist, solder mask, and permanent coatings
  • 2.7 Plugged-hole materials
  • 2.8 High density interconnect
  • 2.9 Stiffener and adhesive (external bonding) materials
  • 3 FMIC Constructions
  • 3.1 General
  • 3.2 Singlelayer (dielectrics)
  • 3.3 Multilayer (dielectrics)
  • 3.4 Flexible
  • 3.5 Flex-to-install
  • 3.6 Rigid
  • 3.7 Multilayer rigid flex composite
  • 3.8 Flammability classification only
  • 3.9 Glossary of construction and FMIC titles
  • 4 Processes
  • 4.1 General
  • 4.2 Process description
  • 4.3 Variations in processes
  • 5 Tests
  • 5.1 General
  • 5.2 Microsection analysis
  • 5.3 Thermal stress test
  • 5.4 Delamination test
  • 5.5 Plating adhesion test
  • 5.6 Bond strength test
  • 5.7 Conductive paste adhesion test
  • 5.8 Coverlay test
  • 5.9 (Ambient)
  • 5.10 Cold-bend test
  • 5.11 Repeated flexing test
  • 5.12 Stiffener bond strength test
  • 5.13 Silver migration test
  • 5.14 Dissimilar Dielectric Materials Thermal Cycling Test
  • 5.15 Flammability tests
  • 5.16 Direct support requirements (DSR) tests
  • 6 Parameter Profile Indices
  • 6.1 General
  • 6.2 Maximum operating temperature (MOT)
  • 6.3 Flammability classification
  • 6.4 Solder limits
  • 6.5 Thickness
  • 6.6 Conductor weight
  • 6.7 Conductor width
  • 6.8 Maximum area conductor diameter
  • 6.9 Direct support requirements (DSR)
  • 7 Markings
  • 7.1 General
  • 7.2 Type designation
  • 7.3 Trademark
  • 7.4 Manufacturer identification
  • 7.5 FMIC category constructions
  • 7.6 Flammability classification
  • 7.7 Flammability classification only constructions
  • 7.8 Direct support requirements (DSR)
  • 7.9 Comparative tracking index (CTI)
  • 7.10 System component symbol (SCS)
  • 7.11 Size class number
  • 7.12 Additional stiffener and adhesive (external bonding) materials

Scope Table of Contents

  • Cover
  • Transmittal
  • Table of Contents
  • Body
  • 1 Introduction
  • 1.1 Scope
  • 1.2 Units of measurement
  • 1.3 Supplementary test procedures
  • 1.4 References
  • 1.5 General
  • 1.6 Glossary
  • 1.7 Abbreviations
  • 2 Materials
  • 2.1 General
  • 2.2 Base materials
  • 2.3 Conductors and conductor adhesives
  • 2.4 Bonding film (supported and unsupported) and internal bonding materials
  • 2.5 Cover material
  • 2.6 Solder resist, solder mask, and permanent coatings
  • 2.7 Plugged-hole materials
  • 2.8 High density interconnect
  • 2.9 Stiffener and adhesive (external bonding) materials
  • 3 FMIC Constructions
  • 3.1 General
  • 3.2 Singlelayer (dielectrics)
  • 3.3 Multilayer (dielectrics)
  • 3.4 Flexible
  • 3.5 Flex-to-install
  • 3.6 Rigid
  • 3.7 Multilayer rigid flex composite
  • 3.8 Flammability classification only
  • 3.9 Glossary of construction and FMIC titles
  • 4 Processes
  • 4.1 General
  • 4.2 Process description
  • 4.3 Variations in processes
  • 5 Tests
  • 5.1 General
  • 5.2 Microsection analysis
  • 5.3 Thermal stress test
  • 5.4 Delamination test
  • 5.5 Plating adhesion test
  • 5.6 Bond strength test
  • 5.7 Conductive paste adhesion test
  • 5.8 Coverlay test
  • 5.9 (Ambient)
  • 5.10 Cold-bend test
  • 5.11 Repeated flexing test
  • 5.12 Stiffener bond strength test
  • 5.13 Silver migration test
  • 5.14 Dissimilar Dielectric Materials Thermal Cycling Test
  • 5.15 Flammability tests
  • 5.16 Direct support requirements (DSR) tests
  • 6 Parameter Profile Indices
  • 6.1 General
  • 6.2 Maximum operating temperature (MOT)
  • 6.3 Flammability classification
  • 6.4 Solder limits
  • 6.5 Thickness
  • 6.6 Conductor weight
  • 6.7 Conductor width
  • 6.8 Maximum area conductor diameter
  • 6.9 Direct support requirements (DSR)
  • 7 Markings
  • 7.1 General
  • 7.2 Type designation
  • 7.3 Trademark
  • 7.4 Manufacturer identification
  • 7.5 FMIC category constructions
  • 7.6 Flammability classification
  • 7.7 Flammability classification only constructions
  • 7.8 Direct support requirements (DSR)
  • 7.9 Comparative tracking index (CTI)
  • 7.10 System component symbol (SCS)
  • 7.11 Size class number
  • 7.12 Additional stiffener and adhesive (external bonding) materials

Details

Edition Number:

2

Edition Date:

10/25/2010

Price Code:

B

Type:

ulstd

ANSI Approved:

03/15/2012

DOD Approved:

—

3-

BS 6221-1:1990, IEC 60326-1:1984

Title / Printed wiring boards. Guide for the specification writer
Abstract / Structure of standards and specifications for printed wiring boards including those under the IECQ scheme.
Status / Current
Publication Date / 28 February 1990
Cross References / BS 2011, BS 4584:Part 102, BS 4727:Part 1:Group 10, BS 5830, BS 6221
International Relationships / IEC 60326-1:1984 Identical
Supersedes Draft / 89/23233 DC
Descriptors / Printed-circuit boards, Printed circuits, Electronic equipment and components, Standards, Specification (approval), Product specification, Detail specification, Quality assurance systems, Assessed quality, Technical writing
ICS / 31.180 (Printed circuits and boards)
Title in French / Cartes pour circuits imprimés. Guide à l'usage de l'auteur des spécifications
Title in German / Gedruckte Schaltungen. Leitfaden fuer den Unterlagenersteller
Committee / EPL/501
ISBN / 0 580 18154 5
Format / A4
Delivery / YES
Pages / 12
Price / £48.00

4-

BS 6221-6:1982, IEC 60326-6:1980

Standard Number / BS 6221-6:1982, IEC 60326-6:1980
Title / Printed wiring boards. Specification for multilayer printed wiring boards
Abstract / Fundamental information on characteristics to be assessed and requirements for the boards irrespective of their method of manufacture and includes a composite test pattern.
Status / Current
Publication Date / 29 January 1982
Cross References / BS 2011, BS 4584, BS 5830, BS 6221:Part 2, BS 6221:Part 3, BS 6221:Part 4, BS 6221:Part 5, IEC 60194, IEC 60326-1, IEC 60326-7, IEC 60326-8, IEC Document 52(Central Office)248
International Relationships / IEC 60326-6:1980 Identical
Amended By / AMD 4978 AMD 6703
Supersedes Draft / 81/27114 DC84/28917 DC
Descriptors / Printed-circuit boards, Printed circuits, Electronic equipment and components, Multiple, Holes, Electroplating, Defects, Wettability, Test specimens, Design, Dimensions, Patterns, Soldered joints, Specimen preparation
ICS / 31.180 (Printed circuits and boards)
Title in French / Cartes imprimees. Specification pour cartes imprimees multicouches
Title in German / Gedruckte Leiterplatten. Spezifikation fuer Mehrlagenleiterplatten
Committee / EPL/501
ISBN / 0 580 12529 7
Format / A4
Delivery / YES
Pages / 32
Price / £136.00