[PROJECT NUMBER] [PROJECT NAME]

[DATE] [PROJECT LOCATION]

ROCKWELL AUTOMATION PROCUREMENT SPECIFICATION

PROCUREMENT SPECIFICATION

Programmable Automation Controllers CompactLogix 5370 L1

NOTICE: The specification guidelines in this document are intended to aid in the specification of products. Specific installations have specific requirements, and Rockwell Automation does not recommend or intend any specific application based solely upon the guidelines provided here. Because of the variety of uses for this information, the user of, and those responsible for applying this information, are responsible for ensuring the acceptability of each application and appropriate use of the guidelines. In no event will Rockwell Automation be liable for misuse, misapplication or reliance on these guidelines in connection with any specific application. Rockwell Automation also disclaims indirect or consequential damages resulting from the use or application of this information.

Note: To download or view a .doc file version of this procurement specification, please visit: www.rockwellautomation.com/industries/procurement-specifications


TABLE OF CONTENTS

PART 1 GENERAL 3

1.01 SUMMARY 3

1.02 RELATED DOCUMENTS 3

1.03 REFERENCES 3

1.04 SUBMITTALS 3

1.05 QUALITY ASSURANCE 4

1.06 DELIVERY, STORAGE AND HANDLING 4

1.07 WARRANTY 4

1.08 MAINTENANCE 4

PART 2 PRODUCTS 5

2.01 MANUFACTURERS 5

2.02 CONSTRUCTION 5

2.03 CPU 5

2.04 MEMORY 7

2.05 I/O CIRCUITRY 7

2.06 PROGRAMMING ENVIRONMENT 8

2.07 COMMUNICATION 8

2.08 POWER SUPPLY 9

2.09 RATINGS 9

PART 3 EXECUTION 9

3.01 EXAMINATION 9

3.02 INSTALLATION 10


SECTION XX XX XX

PROGRAMMABLE AUTOMATION CONTROLLER

PART 1 GENERAL

1.01  SUMMARY

A.  The Programmable Automation Controllers (PAC) shall meet the criteria of this specification for control of process equipment, machinery and systems.

1.02  RELATED DOCUMENTS

A.  Drawings and general provisions of the contract apply to this section.

B.  The following sections contain requirements that relate to this section:

  1. Section 40 90 00 – Process Control System General Requirements
  2. Section 40 95 13 – Process Control Panels and Hardware
  3. Section 01 33 00 – Submittal Procedures
  4. Section ______

1.03  REFERENCES

A.  The PAC shall be listed or recognized by the following registrations:

  1. cULus Listed, Suitable for operation in Class 1 Division 2, Groups A, B, C, and D Hazardous Locations
  2. CE marked, compliant with:

a)  EN 61326-1; Meas./Control/Lab., Industrial Requirements

b)  EN 61000-6-2; Industrial Immunity

c)  EN 61000-6-4; Industrial Emissions

d)  EN 61131-2; Programmable Controllers (Clause 8, Zone A & B)

  1. C-Tick marked, compliant with AS/NZS CISPR 11; Industrial Emissions
  2. Ex marked (ATEX), compliant with:

a)  EN 60079-15; Potentially Explosive Atmospheres, Protection “n”

b)  EN 60079-0; General Requirements

c)  II3 G Ex nA IIC T5X

  1. KC marked

B.  The PAC shall meet Institute of Electrical and Electronics Engineers, Inc. (IEEE) applicable standards.

1.04  SUBMITTALS

A.  As specified in Section 01 33 00.

B.  The supplier shall provide product data for the PAC and any component equipment, including:

  1. Central Processing Unit (CPU) information

a)  Memory

b)  Input/Output (I/O) capacity

c)  Nonvolatile program and data retention

  1. I/O Modules information

a)  Type and rating

b)  Standard wiring diagram

  1. Bill of materials for supplied equipment
  2. Spare parts list

1.05  QUALITY ASSURANCE

A.  The supplier shall provide PAC system components by a single manufacturer:

  1. Only communication modules for communication or network media functions that are not provided by the PAC manufacturer may be produced by third-party sources.
  2. Only PAC manufacturer-approved hardware, including cables, mounting hardware, connectors, enclosures, racks, communication cables, splitters, terminators, taps and removable media, may be used.

B.  All PAC system components shall be new, free from defects and produced by manufacturers regularly engaged in the manufacture of these products.

1.06  DELIVERY, STORAGE AND HANDLING

A.  The supplier shall deliver PAC components in packaging designed to prevent damage from static electricity and physical damage.

B.  The supplier shall store the equipment according to manufacturer requirements and in a clean and dry space at an ambient temperature range of -40 °C to 85 °C (-40 °F to 185 °F).

C.  The supplier shall protect the units from exposure to dirt, water, fumes, corrosive substances and physical damage.

1.07  WARRANTY

A.  The manufacturer shall provide their standard parts warranty for eighteen (18) months from the date of shipment or twelve (12) months from the date of being energized, whichever occurs first.

B.  This warranty applies to PACs.

1.08  MAINTENANCE

A.  As specified in Section 40 61 00.

B.  Provisions shall meet the following installed-spare requirements:

  1. I/O points – 25 percent spare I/O capacity for each type of I/O signal at every PAC and remote I/O location. All spare I/O shall be wired to field terminal blocks.
  2. PAC backplane – the greater of:

a)  25 percent spare capacity, or

b)  3 spare backplane slots.

  1. PAC memory – 50 percent spare program volatile memory.

PART 2 PRODUCTS

2.01  MANUFACTURERS

A.  Allen-Bradley – CompactLogix 5370 L1 Programmable Automation Controller (No substitutions)

2.02  CONSTRUCTION

A.  The programmable automation controller (PAC) shall be an embedded I/O design, with expansion capability. The available expansion shall be local I/O modules or distributed (remote) I/O connected through a network.

  1. A single local chassis shall house CPU, memory, embedded digital I/O, communications interface options and power supply.
  2. The PAC shall be DIN rail mounted.
  3. All system modules, and local and remote chassis shall be designed to operate in:

a)  An industrial environment with an ambient temperature of -20° to 60°C (-4° to 140°F), and with a relative humidity range of 5% to 95%, non-condensing.

b)  A free airflow environment (convection cooling only, no fans or other air moving devices shall be required).

c)  Conformal coating of the PAC shall be offered as an option for use in corrosive/hazardous applications.

  1. All system modules, and local and remote chassis shall be designed and tested to operate in high electrical noise environments.

B.  The system shall support up to 6 [or 8] local expansion modules.

  1. The local expansion modules shall be assembled by mounting a backplane base on the DIN rail and snapping the module and terminal block onto the base.
  2. The terminal block shall provide system power for the backplane, along with wiring and terminations for field-side connections.
  3. The manufacturer shall have available a variety of modules, including AC digital I/O, DC digital I/O, relay contact output, analog I/O, temperature, counter, self-configurable and ASCII.

2.03  CPU

A.  The CPU shall be a self-contained unit, and will be capable of providing control program execution, supporting remote and local programming, controlling all I/O scanning and inter-controller and peripheral communication and diagnostic functions.

  1. 32 tasks (100 programs per task):

a)  Continuous – 1 allowed.

b)  Periodic – Run via an interrupt at a user-defined interval in 1 µs increments from 1 ms to 2000 s.

c)  Event – Triggered by consumed tag, EVENT instruction, plus embedded inputs.

  1. 256 controller connections
  2. Network connections:

a)  256 EtherNet/IP

b)  120 TCP

B.  The PAC shall organize user applications as tasks, which can be specified as continuous, periodic or event based. Tasks can be triggered by input point or instruction.

C.  Programming instructions shall include the following:

  1. Relay-Type (bit)
  2. High-Speed Counter (expansion module option)
  3. Counter and Timer
  4. Data Comparison (for example: Equal, Greater than or Equal, Less than or Equal)
  5. Data Manipulation (for example: Copy, Move)
  6. Logical (for example: And, Not, Or)
  7. Integer and Floating Point Math (for example: Add, Subtract, Multiply, Log 10)
  8. Advanced Math and Trigonometric Functions (for example Sine, Cosine, Tangent)
  9. Statistical
  10. Matrix and Array (for example: COP, CSP, FIFO)
  11. BCD Conversion
  12. Program Flow Control (for example: Jump, Subroutine)
  13. Application Specific (for example: Sequencer)
  14. Diagnostic
  15. Communication
  16. Recipe
  17. Proportional Integral and Derivative (PID)
  18. Block Read and Write
  19. Immediate I/O and Communication Update

D.  The system must be capable of storing the following data:

  1. External Output Status
  2. External Input Status
  3. Timer Values
  4. Counter Values
  5. Boolean Values (0 or 1)
  6. Short Integer Numbers (-128 to 127)
  7. Integer Numbers (-32,768 to 32,767)
  8. Double Integer Numbers (-2,147,483,648 to 2,147,483,647)
  9. Floating Point Numbers to 8 significant digits (for 8+ digits, conversion to exponential form from ±1.1754944 E -38 to ±3.402823 E +38)
  10. Long Integer Numbers (-9,223,372,036,854,775,808 to 9,223,372,036,854,775,807)
  11. Internal Processor Status Information

E.  Data shall be distinguishable to the CPU by address and sub-element mnemonic.

  1. Management of the data into memory subsections shall be an automatic function of the CPU operating system.
  2. Data can be displayed in ASCII, Binary, Octal, Hexadecimal or Decimal.
  3. Function-specific data such as PID, Axis, Axis Group or Message shall have dedicated displays available that annotate the meaning of specific control bits and words within them and allow for selective control where appropriate.

F.  The CPU shall have the ability to back up user program and all data when the main power supply is removed.

G.  The front of the CPU shall have a USB port.

H.  The front of the CPU shall have an integrated latching mechanism for securing the Secure Digital (SD) memory card. The PAC shall operate with the memory card removed.

I.  The CPU shall have a Real Time Clock.

J.  The processor module shall have green, red and yellow LED indicators with sequences for OK (module status), Force, Run, SD, I/O (I/O status), NS (network status), Link 1 and Link 2 (EtherNet/IP port status).

K.  The processor module shall have mode switch positions for Remote, Program and Run.

2.04  MEMORY

A.  The PAC shall have 384 [or 512] KB or user memory.

B.  The program storage medium shall be a solid-state, non-volatile type.

C.  The PAC shall include a 1GB (optional 2GB) SD memory card to store the user program and the firmware of all other modules residing in the same chassis to protect against memory loss. The card shall be rated for use in SIL 2 applications.

  1. When memory is restored, a user-selectable option to restore in Run mode or Program mode shall be provided.
  2. The PAC shall be able to be configured for automatic download from the card on power-up.
  3. The PAC shall be able to be manually triggered to save to or load from the card.

2.05  I/O CIRCUITRY

A.  The PAC shall have embedded I/O:

  1. 16 sinking 24 VDC digital input points.
  2. 16 sourcing 24 VDC digital output points.

B.  The system shall support up to 6 [or 8] local expansion modules for a total maximum of 80 [or 96] I/O points together with embedded I/O.

  1. Maximum expansion shall be available as long as the total current drawn by both the embedded I/O and local expansion does not exceed both the 1A backplane current and the 3A field power current. The manufacturer shall have available for additional backplane current and/or field power current:

a)  I/O expansion power supply

b)  Field power distributor module

  1. The supplier shall configure each expansion module to the optimum requested packet interval (RPI) for the application.

2.06  PROGRAMMING ENVIRONMENT

A.  Programming shall be through the USB 2.0 port or through the EtherNet/IP network.

B.  The programming software shall run on Windows Server 2003, Windows Server 2008, Windows XP Professional, Windows 7 Professional and Windows Vista environments and the programming languages shall be:

  1. IEC 61131-3 compliant ladder diagram (LD)
  2. Structured text (ST)
  3. Function block diagram (FBD)
  4. Sequential function chart (SFC)

2.07  COMMUNICATION

A.  The PAC shall have at least:

  1. USB 2.0 port to support upload and download, online edits, firmware updates and bridging to other modules at full speed (12 Mbps).
  2. EtherNet/IP switch and dual 10/100 Mbps EtherNet/IP ports with 1 IP address. The interface shall support:

a)  IEEE 802.3 Physical and Data Link Standard

b)  Common Industrial Protocol (CIP), the protocol that provides real-time I/O messaging and information/peer-to-peer messaging

c)  Standard TCP/IP and UDP/IP communication

d)  10/100 Mbps auto sensing and auto switching

e)  Standard Ethernet media

f)  Subnet masking

g)  BOOTP and DHCP support

h)  Programmable Automation Controller messaging to peer controllers and workstations

i)  I/O data, real-time interlocking and information

j)  Full or half-duplex communication

k)  Built-in Web access to diagnostics

l)  I/O control

m)  Device level ring (DLR)

n)  Precision Time Protocol (CIP Sync, IEEE 1588)

B.  The manufacturer shall have available:

  1. For serial communications connection –

a)  Module for an RS-232 serial interface.

b)  Module for an RS-422 and RS-485 serial device.

  1. For Modbus communications –

a)  The PAC shall have connection capability to a Modbus TCP network through the embedded Ethernet port with the execution of a ladder-logic routine.

2.08  POWER SUPPLY

A.  The PAC shall operate in compliance with electrical service of 10 to 28.8 VDC (24 VDC nominal) with a minimum line requirement (VDC) of 50 VA, Class 2/SELV.

B.  A single, main embedded power supply shall be integral to the chassis and capable of supplying power to the CPU and local I/O modules. Additional power supply is required for field power.

C.  The power supply shall include:

  1. An easily viewed indicator to show status of the DC power applied to the backplane.
  2. An easily accessible power disconnect switch.

D.  The power supply shall provide electronic protection:

  1. At the time of power-up, the power supply shall inhibit operation of the controller and I/O modules until the DC voltages are within specifications.
  2. The power supply shall automatically shut down the PAC when its output power exceeds 125% of its rated power.
  3. The power supply shall be fused.

2.09  RATINGS

A.  The PAC shall be able to withstand conducted susceptibility tests as outlined in:

Temperature / IEC 60068-2-1
IEC 60068-2-2
IEC 60068-2-14
Humidity / IEC 60068-2-30
Vibration / IEC 60068-2-6
Shock / IEC 60068-2-27
IEC 60068-2-32
Radiated Emissions / CISPR 11: Group 1, Class A
Conducted Emissions / CISPR 11/22: Group 1, Class A
Conducted Emissions - Telecomm / EN 61000-6-4
ESD Immunity / EN 61000-4-2
Radiated RF Immunity / EN 61000-4-3
EFT/B Immunity / EN 61000-4-4
Surge Immunity / EN 61000-4-5
Conducted RF Immunity / EN 61000-4-6
Magnetic Field Immunity / EN 61000-4-8
AC Voltage Variation / EN 61000-4-11
DC Voltage Variation / EN 61000-4-29
Oscillatory Waves / EN 61000-4-18

PART 3 EXECUTION