North Hollywood California 91605 Cell 626 255 1196

JOSE B TAMAYO

7907 Tujunga Avenue

OBJECTIVE:Apply skill and Know-how to Promote High Reliability Assembly Techniques

Currently Certified as an IPC Specialist (J-STD-001) Serial No. J001-S 1854899565

(Over 30 years in the field)

Experience with NASA, Mil Spec and IPC process specifications.

SKILLS:

Can Read and create: schematics, mechanical drawings, wiring diagrams, wiring lists, sketches, assembly documentation, visual aids, scheduling, photo & video documentation.
Software:MS Dos, MS Word, MS Excel, MS Power Point, ORCAD Schematic Capture,, Adobe Photoshop, machine specific software (Various).
Solar Cell Bonding : Developed process for mounting Solar cells onto Micro Satellite Panels.
Micro Electronics (Chip & Wire):assembly and processing, including DIE attach, substrate bonding, ball-bonding, substrate rework, West Bond wedge bonder, Mech-El ball bonder.
Soldering / Through Hole: assembly and hand soldering to NASA 8739/NHB5300.4. Wave flow soldering of through-hole technology PCB’s
Soldering /I-Lead (Stud Joint): component lead forming,hand soldering, Solderability Testing, Tooling, Thermal Cycling, Failure analysis.
Surface Mount Technology:component lead forming including FPGA. SMT assembly, hand soldering, paste & reflow, rework.Own a METCAL BGA rework station, FineTech fineplacer, SMT rework station.
FLIP-CHIP:Polymer flip-chip processing including stud bumping (coining) using K&S 5400 series ball bonder. Modified Flip-Chip process for bonding CMOS Processors to CCD’s to support hybrid imaging technology (HIT). Built a 16 Channel data logger for Europa Probe. Built hybrids for tunneling accelerometer. De-packaging of IC’s to retrieve silicon-die where the purchase is cost prohibitive. Processing using various alignments and bonding machines, such as Finetech Fineplacer.
MEMS(Micro-Electro Mechanical Systems):Silicon wafer wet processing using photolithography techniques, developed a high-speed wet etching process for back thinning 1MP CCD’s and UV detectors. Experience with SiO2 furnace, DRIE etching, Precious Metal Planetary Evaporators, plasma chamber, chemical baths, high power microscopes, Dek-Tak profilometer, disco dicing saw, ultrasonic drill.
Polymerics Applications:Spray conformal coating, painting using thermal paints, component bonding, transfer stamping, board lamination, high-voltage potting, potting of connectors, battery potting, G10 pod bonding & filling using polyurethane foam, fiberglass lay-up, vacuum-bag techniques, solder paste dispensing using Martin Semi-Auto dispenser.
Wiring & Cabling:Spacecraft wiring & cabling, Prototype wiring, Chassis wiring (Box Wiring), Wire Wrapping, Equipment rack wiring cabling. Control panel wiring, Hay wiring for PCB modifications on 25 mil pitch devices, Network cabling CAT 5 and Fiber Optic runs, Large Cable Construction for NASA Trailers, Animatronics wiring, Industrial wiring, Sound & Video Wiring. Safety Systems wiring. Able to build Pegboards and assembly Aids for production manufacturing. Cable Electrical Testing.
Systems Integration/ Mechanical assembly: Installation of camera assembly onto spacecraft MGS and MOC capable of handling and assembling critical components assemblies including sensor level such as CCD’s, Golay cells, MEMS. Opto-electronic flight assemblies such as telescopes, optical lenses for visible and IR frequencies, experience performing auto collimation, alignment & focus. Flight optics cleaning, capable of engineering and producing fixtures for special applications where tight tolerances are critical or just simply handling fixtures to safe guard the hardware, as well as maintaining large Vacuum systems and lab equipment. Can create custom sheet metal boxes or panels with connector cutouts for packaging electronics prototypes & test equipment.
Environmental Testing:Flight systems thermal-vac set up of targets and fixtures in thermal-vacuum chambers, vibration tables, etc. Monitoring pressure gauges, thermocouple gauges, LN2 tanks, actuating moving targets and cleaning of chamber when necessary.
FLT Blanketing:Capable of creating patterns & fabricating flight MLI blanketing for flight instruments and installation.
Facility Construction and Operation:Able to build out facilities from ground up, including framing (wood & metal), electrical, dry-wall, drop-ceilings, air-conditioning, clean-room filter systems, air-line systems, vacuum systems. Chiller-line systems, flooring, painting.
Operation of hand tools:Auto-mechanic tools, electrical, plumbing, residential construction. Specialized torque wrenches, shore hardness gauges, crimping tools, digital multi-meter, paint guns, microscopes, measuring tools.
Operation of Metal Machining equipment:Mill, lathe, drill-press, band saws, grinders, sanders, polishers, digital/analog calipers & micrometers. Novice welder.
Operating power tools:Pneumatic dispensers, pneumatic drills, die grinders, sheet-metal break & shear. Riveting tools, wood construction power tools including table saw, miter saw, router, and scroll saw. Hydraulic Greenlee chassis punches.
Plastics:Hot air plastic welding, Formica laminating, Plexiglas cutting and shaping. Fabricating enclosures for burn-in testing. Working with polypropylene sheets.
Plumbing:Stainless flaring, sweating copper pipe, galvanized, ABS, PVC, de-ionized water systems (polypro), high pressure N2 lines. High-vacuum. AC ducts.
Processes Developed or Involved in:
Involved in process development for high-voltage, high-vacuum potting at JPL
Involved in process development of spray-coating Uralane 5750 at JPL
Involved in process for soldering I-Lead Joints CalTech
Process for wet-etching across a 3“ inch wafer within 1 m JPL
Developed process development for aligning and bonding filters directly onto CCD active area within 20 m for multi-spectral imaging on Mars imagers, MSSS
Developed process for reworking through Parylene-C conformal coating, Altadena Instruments Corp
Developed process for removal of large FPGAS from PCB’S, Altadena Instruments Corp
Developed process for removal Of Bonded components from PCB’S, LORAL Space Systems
Developed process for removal of CCD glass covers, MSSS
Special Skill:Reverse engineering and repackaging/ruggedizing of off-the-shelf hardware for space flight.

EMPLOYMENT HISTORY:

Manufacturing Engineer / Sub-Contractor

CLIENT:Aquila Space Systems(previously Canopus Systems LLC/Stellar Exploration Technologies), Mountain View, Ca.

Cube-Sat Development

Integrated, tested and delivered two Micro-satellites in three months! And Integrated follow-on Payload for Corvus-BC Nano-Satellites X2

Engineering, Electronic packaging, Planning, Development, Training and Scheduling. Services provided to Canopus include: Satellite System Integration, Ruggedized Sub-Systems and lenses for Micro-Satellites, Video Inspection and photo documentation. Solar Cell Bonding, PCB SMT assembly, component bonding, wiring, cabling, conformal coating, painting using thermal paints, mechanical assembly, machining, transfer stamping. Fixture & tooling design and manufacture.(5/13- Present)

Manufacturing Engineer / Sub-Contractor

CLIENT: Ecliptic Enterprises Corp, Pasadena, Ca. Michael Alvarez

Video Recorder and Camera systems for Launch Vehicles and UAV’s Including Airship One,

Engineering, Electronic packaging, planning, development and scheduling. Services provided to Ecliptic included: reverse engineering and repackaging/ruggedizing of off-the-shelf digital cameras and lenses for extreme environments, video inspection and photo documentation. BGA reflow, PCB SMT assembly, component bonding, wiring, cabling, conformal coating, painting using thermal paints, mechanical assembly, machining, transfer stamping, battery sealing & potting. Fixture & tooling design and manufacture.(3/01- 5/13)

Manufacturing Engineer / Sub-Contractor

CLIENT: Malin Space Science Systems, San Diego, CA Michael Ravine PhD

Science Grade Imagers

Aiding in the planning, design and fabrication of flight hardware flown by MSSS for the past 22 years, including MOC, operated in Mars orbit between September 1997 and November 2006 returning more than 240,000 images.Providing personnel training to NASA FLIGHT standards, process development for bonding filters directly onto CCD active area for multi-spectral imaging, PCB SMT assembly, component bonding, wiring, cabling and Parylene coating support.(4/97-Present)

Director of Research & Development (Co-Founder)

ImagerLabs, Monrovia, CA. Gene Atlas CEO

Imaging Sensors

Retrofitted facility to include Class-100 clean room for packaging science-grade CCD’s and continued Flip-Chip process for bonding CMOS processors onto CCD’s started during the JPL effort below. In conjunction with equipment manufacturers, developed process for sub-micron planarity bonding of 4MP detectors onto substrates to accommodate fiber optic light guides. Duties included substrate die attach, Flip-Chip bonding, wire-bonding test articles, process development, chiller-line plumbing, facility, plumbing for wet-etch benches and air exhaust systems. Water chiller maintenance, universal camera test head development, PCB assembly, chassis wiring, cabling. Fixture and tooling design and manufacture. Administrative duties: documentation, planning & scheduling, equipment purchasing and maintenance. (3/02-4/04)

Sr. Technical Assistant / Contractor

JPL Advanced Development Group (Chipton Ross; El Segundo, Ca) Andy Collins

Imaging Sensors

In cooperation with ImagerLabs, developed a modified Flip-Chip process for bonding CMOS processors to CCD’s to support Hybrid Imaging Technology (HIT) used for Op/Nav camera on Mars Reconnaissance Orbiter launched August 2005. Developed a high-speed wet-etching process for back thinning 1MP CCD’s and UV detectors; included building a semiconductor grade lab in my garage, with wet bench, for processing silicon chips. Plumbing for DI water system and exhaust system for processing silicon. (12/00 to 3/02)

Sr. Technical Assistant (Camera Electronics Lead)

Blastoff.com Inc, Idealab (Pasadena, CA); Michael Ravine

Commercial venture to the Moon

Reverse engineering and repackaging of off-the-shelf digital cameras for a commercial venture to the Moon. Assisted in building first article prototype of a lunar rover. Duties included setting up facility (construction) and assembly lab and process planning for the facility and mission; polymeric applications, hand soldering, wiring, fiberglass lay-up, spray-painting with flight grade materials, setting up thermal-cycling chamber, vacuum chamber, machining and testing. (5/00-12/00)

Sr. Technical Assistant / Electronics lead/Super-Tech

JPL Space Instruments Implementation; Neil Pignatano

GALEX Project. Responsible for setting-up lab and overseeing assembly of flight hardware and cabling. Duties included building up test racks to support development and ground test equipment, planning, documentation and collaborating with mechanical engineers to generate appropriate packaging design and drawings. (9/98-5/00)

Sr. Technical Assistant

JPL MEMS (Micro-Electro Mechanical Systems) Howard Rockstad, PHD

Processing of Si wafers for Electron Tunneling Accelerometer project. Involved and the AMES fiber optic Microphone.

Duties included: photolithography, plasma ash cleaning, KOH (Anisotropic) wet-etching, RIE & DRIE (reactive ion etching), LPCVD (Low-pressure chemical vapor deposition), chip level characterizing using high power microscopes and assembly of tunneling sensors, fixture and test set-up, design and manufacture of vacuum pick up tools and holders, micro-probing stations. Responsible for setting up a bath for wet-etching patterns across a 3 inch wafer within 1 micron tolerance. Aided in repairing vacuum pumps and wet bench processing equipment. Hazardous materials generating facility, received health and safety training. (4/98-9/98)

Assistant Engineer / Senior Technical Lead

California Institute of Technology (Planetary Sciences) Pasadena, CA. Ed Danielson

Assisted in the planning/scheduling of daily project duties, personnel training to NASA Flight standards. Supported launch activities and fairing closeout of the DELTA II rocket at Kennedy Space Center for Mars Global Surveyor; built CD writing systems for Hubble Space telescope science team. Transferred direct to CalTech supporting the Electron Tunneling Accelerometer work from Altadena Instruments at JPL MEMS after company closed. Supported The KECK Observatory LOW RES camera with RF cable assemblies and wiring. Developed a 1-inch 16 channel data-logger using Flip Chip technology for the Rosseta Champollion proposal, assisted in the design and development of an autonomous weather station for Antarctica, developed process for retrieving silicon chips from plastic packaged Dip IC’s, using fuming nitric acid for the data-logger effort. (2/96-4/98)

Sr. Technician Lead / Support Engineer Contractor

Caltech / Altadena instruments Corp. Pasadena, Ca. Michael Ravine

Supported launch activity at Kennedy Space Center for Mars Observer.Responsible for developing I-Lead process soldering and assembly techniques for the Mars Observer Camera project, Mars Orbiter Camera project at CalTech and supported the Electron Tunneling Accelerometer project for JPL MEMS Group. Assembly and test of redundant electronic systems (digital, analog, power supply), cabling, mechanical assembly, optics integration, vibration testing support and thermal vacuum testing support, design and assembly of test fixtures and handling aids. Hybrid assembly using polymer flip-chip and supported the packaging design and sensor integration, schematic capture using ORCAD, assembly documentation and collaboration with project and JPL QA Engineers. Built Class-100 clean room and oversaw build-out of offices and maintained lab. Trained personnel to NASA Flight standards. (1/91-2/96)

Electrical Tech Lead / Sparky#1 Contractor

Walt Disney Imagineering CDI Corp Encino, CA. Pedro Flores

Involved in the Star Tours cabins re-habilitation project, Tower of Terror and Alien Encounter. Aided in the daily planning and scheduling of work to be performed. Duties included: training personnel, oversight and hands on wiring main AC electrical, safety systems, sound systems, IR camera systems and animatronics wiring (Alien). Worked from blue prints, schematic diagrams and oral instructions. (9/93 3/94)

Lead Polymerics Lab Technician Contractor

Loral Electro Optical Systems, Pasadena, CA. (Mainstream engineering). K Woodard

Responsible for re-organizing and training personnel to improve lab capability, building flight hardware for NASA/JPL, TRW, CalTech and Loral internal projects such as ruggedizing CRT’s for Space Shuttle, used with the Drop Physics Module. Duties: component bonding, substrate bonding using vacuum bag method, conformal coating, and high-voltage potting (vacuum chamber process). Maintained vacuum chamber, ovens and -80 freezers, worked from mechanical drawings, sketches and oral instructions. (10/90-1/91)

Sr. Electro-Mechanical Technician Contractor

JPL (Mainstream Engineering). Fred Thompson

Assisted in the fabrication design and testing of prototype assemblies by means of schematics, wiring diagrams, wire lists, sketches and oral instructions for DSN (Deep Space Network) antenna ground systems in Goldstone and Canberra. Duties included flight systems: harness and cabling, PWB assembly, wire wrapping, chassis wiring, cable lay-up, component bonding, PCB laminating, high voltage potting, transfer stamping, connector potting, provided tech-support during vibration and thermal vacuum testing for various projects. Worked at SAF (Spacecraft Assembly Facility) during integration and test of various projects. Traveled to New York as an instructor/technician to support assembly and training of personnel for ruggedized computer systems on the ASAS (All Source Analysis System) military project. Worked in the polymeric lab, processing as well as performing maintenance of vacuum chambers, ovens and spray equipment. (3/86-6/90)

Electro-Mechanical Technician Contractor

TRW (HL YOH inc. Encino, CA.) Alice Mejia

Assembled printed circuit boards and spot bonded components to NASA specifications using blueprints and FIPP’s as a reference. (10/85-2/86)

Lead Rework Technician Contractor

Litton data command systems Night Shift HL YOH inc. Encino, CA. Lee Boles

Reworked/upgraded communication trailers for Saudi Arabian Government. Completely rewired units from wiring diagrams. Modified printed circuit boards to meet new specifications. Duties included wire wrapping, soldering wire connections, and electronic components, conformal coating, chassis harnessing, cabling, large-scale cables, chassis modifications. (6/85-10/85)

Electronic Assembler

Instrumentation Technology Systems, Northridge, CA. Janet Hoag

Involved in the development of various missile targeting systems and intercom units. Assembled printed circuit boards from preliminary prints, working cooperatively with engineers. Updated printed circuit boards to meet new models. Ran production line for PCB assembly, operated and maintained wave-flow solder machine; wired complex control panels for Maximum security prison from wiring lists and diagrams. Assembled chassis for production units. . (6/84-10/85)

Assembly Equipment Operator

AJ Electronics corp. Chatsworth, CA. Robert (BOB)

Worked in the large equipment section, mass manufacturing IBM mother boards for the computer industry. Operated automatic axial component machine, automatic IC inserter and flow soldering machine, aided touch-up and re-work line when necessary. Aided in the planning of production runs and training operators. (5/82-6/84)

TRAINING:

Certified NASA Instructor 2006-2008:Flight systems Critical Item Handling; Flight Systems Connector Mate/De-mate; Torquing of Electronic Assemblies; Electrostatic Discharge (ESD) Control.
Certified NASA Technician from 1986 to 2006 (20 years) in:Flight Systems Polymeric Applications; Hand Soldering to NHB 5300.4; Flight Systems Mechanical Assembly; Harnessing and Cabling; Flight Systems Cable Fabrication; Flight Systems Connector Crimping; Flight Systems Wire Wrap Assembly; Flight Systems Electronic Equipment Handling; Connector Mate and De-mate; Flight Systems Separation Force Testing; Flight Systems Connector Cleaning; Flight systems Critical Item Handling.
North Valley Occupational Center, Auto Body Repair & Paint
K&S for Ball Bonder repair and Maintenance.

EDUCATION:

Up to 11.5 Grade of High school, 6 semesters of Auto Shop

AWARDS:

NASA's Group Achievement Award for exceptional achievement in the definition, development, and operation of the MASTCAM, MAHLI, and MARDI instruments and Science Investigations July 18 2013.
NASA's Group Achievement Award for GRAIL MoonKAM Flight Hardware Team For Outstanding Performance in providing the MoonKam, an exceptional Education and Public outreach resource onboard the Grail spacecraft, to NASA at an affordable cost Aug 2012.
NASA's Technology and Applications Programs, Group Achievement Award for STRV-1d QWIP Development Team In recognition of excellent performance and team effort to deliver the Quantum Well Infrared Photoconductor (QWIP) technology validation experiment to the STRV-1d Project January 28 2000.
JPL NOVA Award for GALEX Project June 2000.
JPL NOVA Award for Commitment to Excellence Space Instruments June 1999.
NASA's Group Achievement Award for Mars Global Surveyor Exceptional Management and Technical Achievement in the Implementation, test, and Flight readiness Of the MGS payload Instruments April 1997.
NASA's Group Achievement Award for Most Advanced Instrument ever Flown to a planet. Mars Orbiter Camera Feb 1993.
NASA Mars Observer Patch & Certificate contribution to the successful Launch September 25 1992.
109 RocketCam systems on rockets and 12 spacecrafts with no known failures.

PROJECTS: