Process

/

Data

A.Board / Lamination /
  1. Board dimension max:
2. Minimum laminated Board thickness
3. Multi-layer alignment precision

/ 490 x 590 mm A.1
0.2 mm
± 0.05mm A.2 A.2
B. Basic Material /
  1. Material: Per customer requirement
  2. Thickness capability
  3. Thickness capability (incl.HAL)
/ FR-1, FR-2, FR-4, HitgFR4, CEM-3, flex: Polyimide
0.1mm ~ 3.2mm
0.23mm ~ 3.2mm

C. Drilling

/
  1. Maximum drill size
  2. Minimum mech. drill size
  3. Minimum Laser drill size
  4. Hole size tolerance
  5. Hole position tolerance
/ 6.5 mm
0.20mm
0.10mm
± 0.025 mm
± 0.076mm C.4
D. Dry film /
  1. Minimum line width
(1/2 oz base copper)
  1. Minimum line width
(1 oz base copper)
  1. Minimum spacing
(Line to line, 1/2 oz base copper)
  1. Minimum spacing
(Line to line, 1 oz base copper) / 0.10mm
0.127mm D.1 D.2
0.10mm
0.127mm D.3 D.4
Process / Data
D. Dry film /
  1. Minimum spacing
(Pad to pad , 1/2 oz base copper)
  1. Minimum spacing
(Pad to pad, 1 oz base copper)
  1. Minimum spacing (line to pad)
  2. Minimum bonding lead width
1/2 oz base copper
  1. Minimum bonding lead width
(1 oz base copper)
  1. Minimum spacing between bonding lead
  2. Minimum annular ring
  3. Front/Back alignment
  4. Minimum spacing between line to
NPTH hole / 0.1 mm
0.127mm
0.1 mm D.5 D.6 D.7
0.12 mm

0.15 mm

0.10 mm
0.10 mm D.11 D11
± 0.05 mm
0.2 mm


D.12 D.13
E. Plating /
  1. Copper thickness in hole
(Per customer requirement)
  1. Copper thickness in hole
(Gold plating board)
  1. Nickel plating thickness
  2. Gold plating thickness (immersion gold)
  3. Finished hole size tolerance
/ 20μm
E.3
20μm
2.5~5μm
0.0076μm ~ 0.2286μm
± 0.076 mm E.1 E.2
Process / Data

F. Etching

/
  1. Finished line width deviation
(1 oz base copper HAL board)
  1. Finished spacing deviation
(1 oz base copper HAL board)
  1. Total under cut (1/2 oz base copper)
  2. Total under cut (1 oz base copper)
/ ±10%

±20% F.3 F.4 Under cut x 2

track width –10%
track width –20%
G. Solder
Mask / 1. Minimum solder mask clearance
2. Minimum solder mask line coverage
3. Minimum solder mask bridge / 0.05 mm G.1
0.075 mm
0.1 mm G.3
G.2

H. Legend

/ 1. Minimum marking width
  1. Minimum marking to hole spacing
(Marking in hole is not allowed)
  1. Minimum marking to pad spacing
(Marking on pad is not allowed) / 0.15 mm
0.2 mm H.2
0.2 mm
H.3 H.1
I. Carbon ink / 1. Minimum spacing between two carbon line
2. Minimum carbon line width / 0.2 mm
0.2 mm
J. 2nd Drill / 1. True position tolerance / ± 0.076 mm
K. Routing / 1. Outline dimension tolerance
2. Outline to drill hole position tolerance
3. Outline to conductor position tolerance
4. Minimum outline to conductor
5. Minimum outline to drill hole spacing / ± 0.1 mm K.4 K.3 K.5
± 0.05 mm
± 0.05 mm
0.1 mm
0.1 mm K.2

Process

/

Data

L. Punching

/ 1. Outline dimension tolerance
2. Outline to drill hole position tolerance
3. Outline to punch hole position tolerance
4. Outline to conductor position tolerance
5. Minimum outline to conductor spacing
6. Minimum outline to hole spacing
7. Punch hole ture position tolerance
8. Punch hole size tolerance
9. Minimum punch hole size / ± 0.1 mm L.4 L.5 L.6
± 0.05 mm
±0.05 mm
± 0.05 mm
0.2 mm L.2
same as PCB thickness
± 0.1 mm
+ 0.05 / -0.1 mm
0.70 mm
L.3

M. V-cut

/ 1. Front/Back alignment tolerance
2. Minimum spacing between V-score and conductor
3. Remained thickness tolerance
4. V-score to V-score tolerance
5. V-score to outline tolerance
  1. V-score angle tolerance
  2. possible v-cut angles
/ ± 0.1 mm M.2
0.2 mm
± 0.05 mm M.3
± 0.1 mm
± 0.1 mm M.1
± 3°
30, 45 degree
N. Chamfer / 1. Chamfer depth tolerance
2. Chamfer remained thickness tolerance / ± 0.1 mm N.1
± 0.1 mm
N.2