Background Statement for SEMI Draft Document #4712B

Semiconductor Equipment and Materials International

3081 Zanker Road

San Jose, CA 95134-2127

Phone: 408.943.6900, Fax: 408.943.7943

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Background Statement for SEMI Draft Document #4712B

New Standard: Guide for F-GHG (Fluorinated Greenhouse Gas) Emission Characterization and Reduction

Notice: This background statement is not part of the balloted item. It is provided solely to assist the recipient in reaching an informed decision based on the rationale of the activity that preceded the creation of this Document.

Notice: Recipients of this Document are invited to submit, with their comments, notification of any relevant patented technology or copyrighted items of which they are aware and to provide supporting documentation. In this context, “patented technology” is defined as technology for which a patent has issued or has been applied for. In the latter case, only publicly available information on the contents of the patent application is to be provided.

Background

This is a technical ballot as Doc. #4712B.

We, the GHG Emission Characterization Task Force, have prepared this draft document after review of all the negatives and comments submitted to Doc. #4712A.

Due to rapid progress of climate change, the demand of GHG emission reduction is greatly growing. Based upon following reasons which show necessity of an industry guide, the TF developed this guide as a SEMI standard.

· According to the 2006 Intergovernmental Panel on Climate Change (IPCC) Guidelines, default values for calculating efficiency of an abatement system are usable under a condition that the performance of the system is kept.

· Japanese Law Concerning the Promotion of Measures to Cope with Global Warming requires to report GHG emissions to an emission generator over a certain amount. According to Ministry of the Environment, a calculation method or an emission coefficient other than one shown on the legal instrument is usable, if data are based upon actual measurement of GHG.

· The US EPA introduced electronics industry a draft “Protocol for Measuring Destruction or Removal Efficiency (DRE) of Fluorinated Greenhouse Gas Abatement Equipment in Electronics Manufacturing” through the 15th ISESH and some opportunities.

· The US Government concluded to require reporting GHG emission over 25000CO2equivelant ton/ year from 2011, to entities having sites in the USA.

· Korean “Low Carbon Green Growth Law” which became mandatory in 2010 requires total GHG emission reduction.

· Taiwan is now discussing whether Taiwan should enact a GHG tax system.

· For the purpose, accurate emission characterization is strongly expected.

· For the ME or the abatement tool suppliers who deliver their products globally, the SEMI standard is useful to conduct their businesses smoothly.

The voting results of Doc. #4712B will be reviewed by the GHG Emission Characterization Task Force on March 23, 2012, and will be adjudicated at the Japan EHS Committee meeting scheduled on April 19, 2012 at SEMI Japan office.

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

Page 12 Doc. 4712B ã SEMIâ

Semiconductor Equipment and Materials International

3081 Zanker Road

San Jose, CA 95134-2127

Phone: 408.943.6900, Fax: 408.943.7943

hb khghgh1000A4712B

If you have any question, please contact the following Task Force co-leaders or SEMI staff:

GHG Emission Characterization Task Force co-leaders:
Shigehito Ibuka (Tokyo Electron); e-mail:
Minoru Kagino (Toshiba); e-mail:

SEMI staff:
Akiko Yamamoto (SEMI Japan); e-mail:

Page 12 Doc. 4712B ã SEMIâ

Semiconductor Equipment and Materials International

3081 Zanker Road

San Jose, CA 95134-2127

Phone: 408.943.6900, Fax: 408.943.7943

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SEMI Draft Document #4712B

New Standard: Guide for F-GHG (Fluorinated Greenhouse Gas) Emission Characterization and Reduction

1 Purpose

1.1 This document provides guidance to characterize fluorinated greenhouse gas (F-GHG) emitted from manufacturing equipment (ME).

1.2 This document provides guidance to characterize F-GHG destruction or removal efficiency (DRE) of an abatement tool.

1.3 This document also addresses continuous improvement planning for emission reduction on ME or an abatement tool.

NOTE 1: Because this SEMI standard is a “Guide”, all criteria using “should” may be considered optional.

2 Scope

2.1 Greenhouse gases (GHGs) to which this guide applies are CF4, C2F6, C3F8, c-C4F8, CHF3, SF6 and NF3.

NOTE 2: In addition to above gases, this guide may be applicable to other F-GHGs .

2.2 This guide applies to F-GHG emission characterization from ME.

2.3 This guide applies to F-GHG emission characterization from an abatement tool.

2.4 This guide applies to characterization of consumption, residues, byproducts or recombination of F-GHG through chemical reaction in ME.

2.5 This guide applies to specification of F-GHG DRE on an abatement tool.

2.6 It is recommended to use this guide in semiconductor, TFT-LCD, photovoltaic industries at least.

2.7 This guide contains the following sections:

· Purpose

· Scope

· Limitations

· Referenced Standards and Documents

· Terminology

· General Provisions

· Baseline Recipe(s)

· Measurement Instruments

· Measurement and Characterization of F-GHG Emission

· Timing and Frequency of F-GHG Emission Characterization

· Reporting

· Record Keeping of Data Characterized

· Roadmap and Continuous Improvement

NOTICE: SEMI Standards and Safety Guidelines do not purport to address all safety issues associated with their use. It is the responsibility of the users of the Documents to establish appropriate safety and health practices, and determine the applicability of regulatory or other limitations prior to use.

3 Limitations

3.1 This guide is not intended to supersede the applicable codes and regulations of the region where the characterization is conducted, or the region where the information developed may be used.

3.2 This guide is not intended to restrict characterization method of F-GHG emission, utilization, or DRE.

3.3 This guide is not intended to restrict data management of F-GHG emission, utilization, or DRE.

4 Referenced Standards and Documents

4.1 SEMI Standards and Safety Guidelines

SEMI S2 ― Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment

SEMI S23 ― Guide for Conservation of Energy, Utilities and Materials Used by Semiconductor Manufacturing Equipment

4.2 IPCC Document[1]

2006 IPCC Guidelines for National Greenhouse Gas Inventories － Volume 3 Industrial Processes and Product Use － Chapter 6 Electronics Industry Emissions

4.3 ISMI Document[2]

#01104197A-XFR ― Guideline for Environmental Characterization of Semiconductor Equipment

#06124825B-ENG ¾ Guideline for Environmental Characterization of Semiconductor Process Equipment, Revision 2

4.4 Seiko Epson Document[3]

Simple Method for PFC Characterization using FT-IR

4.5 US EPA Protocol[4]

EPA 430-R-10-003 ― Protocol for Measuring Destruction or Removal Efficiency (DRE) of Fluorinated Greenhouse Gas Abatement Equipment in Electronics Manufacturing

NOTE 3: JEITA[5] is developing “JEITA Guideline for F-GHG Characterization and Management”.

NOTICE: Unless otherwise indicated, all documents cited shall be the latest published versions.

5 Terminology

5.1 Abbreviations & Acronyms

5.1.1 DRE ¾ Destruction or Removal Efficiency

5.1.2 FCs ¾ Fluorinated Compounds

5.1.3 F-GHG ¾ Fluorinated Greenhouse Gas

5.1.4 FT-IR ¾ Fourier Transform-InfraRed

5.1.5 GC-MS ¾ Gas Chromatography-Mass Spectrometry

5.1.6 GHG ― Greenhouse Gas

5.1.7 GWP ¾ Global Warming Potential

5.1.8 HTF ― Heat Transfer Fluide

5.1.9 IPCC ¾ Intergovernmental Panel on Climate Change

5.1.10 ISMI ¾ International SEMATECH Manufacturing Initiative

5.1.11 ME ¾ Manufacturing Equipment [such as semiconductor, FPD (Flat Panel Display) or photovoltaic manufacturing equipment]

5.1.12 MFC ¾ Mass Flow Controller

5.1.13 PFCs ¾ PerFluoro Compounds

5.1.14 QMS ¾ Quadrupole Mass Spectrometer

5.1.15 SEMATECH ¾ Semiconductor Manufacturing Technology Institute

5.2 Definitions

5.2.1 baseline ¾ operating conditions, including process chemistry, for which the equipment was designed and manufactured. [SEMI S2]

5.2.2 environmental impact ¾ positive and negative effects to the earth environment from a variety of sources including people and their activities, and the operation of manufacturing equipment and facilities.

5.2.3 recombination ¾ other material to which is joined after an original material is broken.

5.2.4 roadmap ¾ a sequence for the incremental introduction or improvement of technology over time with month or year milestones and supporting information. [SEMI S23]

5.2.5 source gas residue F-GHG ¾ unreacted F-GHG after processing such as chamber cleaning or dry etching of substrates.

5.2.6 system integrator ¾ party that integrates manufacturing equipment and an abatement system. A system integrator can be a user of manufacturing equipment and an abatement system, or a supplier who is named to be a system integrator by contract.

5.2.7 utilization ¾ fraction of a gas destroyed or transformed by reaction process such as CVD or etching (so-called “use rate” in “2006 IPCC Guidelines for National Greenhouse Gas Inventories”)

6 General Provisions

6.1 The document reader is recommended to understand the meaning of GHG emission characterization and DRE of abatement tool written in Chapter 6 “Electronics Industry Emissions” of “2006 IPCC Guidelines for National Greenhouse Gas Inventories － Volume 3 Industrial Processes and Product Use.”

7 Baseline Recipe(s)

7.1 The measurement, monitoring, improvement, and reporting methods should be conducted using one or several supplier baseline recipe(s).

NOTE 4: The ME or the abatement tool supplier is encouraged to consider baseline recipe(s) which also meet the needs of the users.

7.2 Recipe(s) should include gas species, process time, vacuum pressure, process temperature, idle time, etc.

8 Measurement Instruments

NOTE 5: Outlines of FT-IR and QMS are shown in Related Information 1.

8.1 Measurement instrument should be appropriately calibrated prior to measurement.

8.1.1 Calibration of measurement instrument should be conducted for each F-GHG to be characterized.

9 Measurement and Characterization of F-GHG Emission

NOTE 6: Following documents may be useful to characterize F-GHG emissions.

· 01104197A-XFR and #06124825A-ENG of ISMI

· Simple Method for PFC Characterization using FT-IR

9.1 Total volume of each F-GHG is defined as sum of time integration of values calculated based upon “F-GHG concentration multiply gas flow rate”.

(1)

Vi: Gas volume for ith gas (ith: 1st, 2nd, 3rd, 4th, 5th…)

t : Measurement timing

T : Total time for measurement

Ci(t): Concentration for ith gas

Fi(t): Gas flow rate for ith gas

9.2 Following shows how to measure F-GHGs including byproducts, the emitted gas flow rate, and measurement time. Based upon such data, mass balance between the input and the output of the ME, or the DRE of the abatement tool can be specified.

9.2.1 Measurement of F-GHG Concentration

9.2.1.1 Measure emissions including gas phase byproducts.

9.2.1.2 Measurement should be conducted by a qualified method such as FT-IR, which is described on “Guideline for Environmental Characterization of Semiconductor Process Equipment – Revision 2 (ISMI Technology Transfer #06124825B-ENG)”.

NOTE 7: For use of FT-IR, the simplified FT-IR is shown in Related Information 1.

9.2.2 Identification of F-GHG Flow Rate

9.2.2.1 Sum each flow rate of input gases.

9.2.2.2 A gas, for which the concentration is already known should be used for the reference.

9.2.3 Identification of Measurement Time

9.2.3.1 Identification of F-GHG measurement time can be calculated from time which input gases are flowing other than identifying actual measurement time.

9.2.4 Emission Characterization

9.2.4.1 It should be conducted at a certain change such as process recipe change of the ME, the ME configuration change, or the abatement tool configuration change.

9.2.4.2 If repeatability of each measurement or linearity of concentration to absorbance is not shown, any malfunction of the ME, the abatement tool or the measurement instrument should be investigated.

NOTE 8: Repeatability and/or linearity shoud be defined by a suppler.

9.2.4.3 Emission from the ME

9.2.4.3.1 Emission from the ME should be characterized for one or several supplier baseline recipe(s).

9.2.4.3.2 Utilization, recombination, gas consumption, and source gas residue F-GHG can be characterized by analysis of the emission data.

9.2.4.4 Utilization in the ME

9.2.4.4.1 It should be calculated from each input F-GHG to the ME and each emitted F-GHG from the ME. The following formula should be used.

F-GHG utilization =

(each input F-GHG volume – each emitted F-GHG volume)/ each input F-GHG volume (2)

9.2.4.4.2 Each baseline recipe should be used to identify each utilization.

9.2.4.4.3 When determining the reaction rate, at least five process runs should be measured for each recipe.

9.2.4.5 Input F-GHG to the Abatement Tool and Emitted F-GHG from the Abatement Tool

9.2.4.5.1 Total input F-GHG volume should be identified based upon actual measurement.

NOTE 9: When an abatement tool such as combustion type or plasma type is turned off, measurement result at the outlet of the abatement can be considered equivalent to measurement result at the inlet of it.

9.2.4.5.2 Total emitted F-GHG volume should be identified based upon actual measurement.

9.2.4.6 DRE of the Abatement Tool

9.2.4.6.1 It should be calculated from each input F-GHG to the abatement tool and each emitted F-GHG from the abatement tool. The following formula should be used.

F-GHG DRE =

(each input F-GHG volume – each emitted F-GHG volume) / each input F-GHG volume (3)

NOTE 10: The EPA protocol should be referred for appropriate characterization using tracer gas on an abatement tool.

9.2.4.7 Performance Verification of the Abatement Tool

9.2.4.7.1 The abatement tool supplier should review the abatement tool performance before the delivery.

9.2.4.7.2 For some abatement tool, comparison with measurement result of outlet gases on non-activation and activation of an abatement tool may be used to measure the tool performance.