Reading Worksheet Class 7 Physics 585. Please complete and bring to class on______.
We will use it to guide discussion and you will hand it in later. Name______
Your QUESTIONS are important. WRITE down at least two you have. Put star by the items of greatest misunderstanding.
Class 7: Ohring Chapter 4: sections 4.5 to end (pp. 170-201.) Look at figure 4-19 several times during your reading to tether the info being thrown at you.
4.5.1 Ohring looks at this chapter as being science of ion-surface interactions.
- Look at figure 4-9 twice. Once right now and again as you finish the chapter.
- Figure 4-10 is schematic in nature. Understand reason for all three regions.
4.5.2
- Which class of ions is most likely to reflect?
- High-energy, massive, normal-incidence ions? Or something else?
- Why?
- Figure 11. C. is historical. People thought maybe sputtering was atomic scale e-beam. (Thermal spike leading to evaporation.) But what is the mechanism really?
- Why is there an energy threshold for sputtering?
- What is the basic rule? Why?
- What is gamma?
Sputter yield. Things to think about include:
What are the minimum and maximum S you can find in the text?
- Table 4-2 has two kinds of facts. Sputter yield and threshold.
- What is the minimum and maximum S in table?
- How many sputtering formula can you find in text?
- What are the factors in the various sputter formulae?
- Low-energy sputter?
- High-energy sputtering?
- Linear collision region?
- How good is the comparison with experiment?
- Alloys (page 180-1): How many monolayers of target are consumed to achieve steady-state composition?
- A potpourri of sputtering results 7 effects
- What two are most interesting to you?
- What angle gives largest sputter yield?
4.6 Modification of growing films
- 4.6.1 Perhaps read it twice but don’t worry if you can’t capture it.
- 4.6.2 Thermal spikes- read last sentence first and last.
4.6.3 contains the major issues.
- Topography.
- What are the new words/terms?
- Draw a picture that captures some of the important ideas.
- Crystallography and texture.
- Do you understand what texture means?
- Do you understand fig. 4-16?
- Grain structure: be prepared to communicate your understanding of fig. 4-17.
- Defects and Stress. Be prepared to communicate your understanding of these.
- Compositional modification of surfaces: Be prepared to communicate your understanding of this.
- Ion implanting and other high-energy processes.
Ask yourself what are the conditions that lead to each of the four processes.
Is it different energies, doses or some other property such as the crystallinity & orientation of the substrate? - Implantation 191-93
- What is symbol for stopping power?
- Do you understand 4-43 in light of assigned HW?
- What is Rp?
- What is straggling and what is symbol?
- Channeling has nothing to do with psychics
- Where is ion-beam mixing mostly likely to be important for you?
- What is the basic rule of dose in determining if amorphization is going to happen?
4.7 Conclusion
- Look at Fig 4-19 (again).
- Do you see an answer to an essay question here?
- Read last of section to see Ohring’s answer.
- Table 4-3 compares evaporation vs. sputtering for thin films.
- It could provide the answers for three potential essay questions.
- Read over it looking for the answer to such questions.
- What is one such question?
- How would you answer it?